SCHEMBL7025871

SCHEMBL7025871

CC1(C(=O)OC(=O)C2(C)CC=CCC2C(=O)O)CC=CCC1C(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10476965 0.88 MEN1 (0.33)
SCHEMBL28405609 0.83 MEN1 (0.33)
SCHEMBL1989180 0.83 MEN1 (0.36)
SCHEMBL1926380 0.83 MEN1 (0.36)
SCHEMBL1285662 0.83 MEN1 (0.36)
SCHEMBL10740811 0.83 MEN1 (0.36)
SCHEMBL27569243 0.79 CA1 (0.35)
SCHEMBL1443386 0.75 SLC1A2 (0.36)
SCHEMBL19412129 0.75
SCHEMBL29953213 0.70 CD81 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113383052-B Optical film adhesive, adhesive layer, optical element, and image display device 三星SDI株式会社 2023-05-16 CN disclosed
CN-113631634-A Polyamic acid composition, polyimide composition, and polyimide molded article 株式会社大阪曹达 2021-11-09 CN disclosed
CN-108884245-B Polyimide film and method for producing same 柯尼卡美能达株式会社 2021-10-29 CN disclosed
CN-113383052-A Optical film adhesive, adhesive layer, optical element and image display device 三星SDI株式会社 2021-09-10 CN disclosed
CN-109843534-B Method for manufacturing optical film 柯尼卡美能达株式会社 2021-05-18 CN disclosed
CN-109843533-B Method for manufacturing optical film 柯尼卡美能达株式会社 2021-05-04 CN disclosed
CN-112543891-A Resin composition for protective agent and use thereof 株式会社有泽制作所 2021-03-23 CN disclosed
WO-2020196721-A1 POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION AND POLYIMIDE MOLDED BODY 株式会社大阪ソーダ 2020-10-01 WO disclosed
WO-2020026666-A1 RESIN COMPOSITION FOR RESISTS AND USE THEREOF 株式会社有沢製作所 2020-02-06 WO disclosed
CN-105408393-B The manufacturing method of clear polyimides copolymer, polyimide resin composition and formed body and the copolymer 索马龙株式会社 2019-08-06 CN disclosed
CN-109843533-A The manufacturing method of optical film 柯尼卡美能达株式会社 2019-06-04 CN disclosed
US-10189949-B2 Transparent polyimide copolymer, polyimide resin composition and molded article, and production method of said copolymer SOMAR CORPORATION (JP) 2019-01-29 US disclosed
CN-108884245-A Polyimide film and method for producing same 柯尼卡美能达株式会社 2018-11-23 CN disclosed
US-10053541-B2 2018-08-21 US disclosed
US-20160168328-A1 TRANSPARENT POLYIMIDE COPOLYMER, POLYIMIDE RESIN COMPOSITION AND MOLDED ARTICLE, AND PRODUCTION METHOD OF SAID COPOLYMER SOMAR CORPORATION (JP) 2016-06-16 US disclosed
EP-0967522-B1 Positive photosensitive resin composition FUJI PHOTO FILM CO LTD (JP) 2003-02-19 EP disclosed
US-6159656-A Positive photosensitive resin FUJI PHOTO FILM CO., LTD. (JP) 2000-12-12 US disclosed
EP-0967522-A1 Positive photosensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 1999-12-29 EP disclosed