SCHEMBL702679

SCHEMBL702679

CC(=O)OC(C[SiH2]C[SiH2]CC(OC(C)=O)OC(C)=O)OC(C)=O

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.40
CHRM2 P08172 1/20 0.35
CHRM4 P08173 1/20 0.35
CHRM1 P11229 1/20 0.35
TBXA2R P21731 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.34
GALR3 O60755 1/20 0.34
MAPT P10636 1/20 0.34
BLM P54132 1/20 0.34
TDP1 Q9NUW8 1/20 0.33
ALOX15 P16050 1/20 0.32
MEN1 O00255 1/20 0.31
CYP1A2 P05177 1/20 0.31
HRH1 P35367 1/20 0.31
KMT2A Q03164 1/20 0.31
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705907 0.88 TSHR (0.42) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL707752 0.84 TSHR (0.39) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL701706 0.84 TSHR (0.39) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL705614 0.77 TSHR (0.37) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL713402 0.74 TSHR (0.34) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL705615 0.73 TDP1 (0.44) TSHRSMN1; SMN2TDP1MEN1CYP1A2
SCHEMBL25406773 0.71 TSHR (0.36) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10782810 0.71 TSHR (0.50) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL713403 0.70 ALOX15 (0.38) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL703611 0.70 TSHR (0.34) TSHRCHRM2CHRM4CHRM1TBXA2R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed