Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.50 |
| ▸ | ESR2 | Q92731 | 12/20 | 0.35 |
| ▸ | QDPR | P09417 | 2/20 | 0.34 |
| ▸ | ESR1 | P03372 | 6/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | USP2 | O75604 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | PKM | P14618 | 1/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | RELA | Q04206 | 1/20 | 0.32 |
| ▸ | KDM1A | O60341 | 1/20 | 0.30 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7196040 | 0.69 | SMN1; SMN2 (0.42) | SMN1; SMN2ESR2QDPRESR1KDM1A | |
| SCHEMBL11033224 | 0.69 | SMN1; SMN2 (0.42) | SMN1; SMN2ESR2QDPRESR1KDM1A | |
| SCHEMBL20392266 | 0.67 | SMN1; SMN2 (0.51) | SMN1; SMN2ESR2QDPRESR1NPC1 | |
| SCHEMBL3134427 | 0.66 | SMN1; SMN2 (0.50) | SMN1; SMN2ESR2QDPRESR1HSD17B10 | |
| Hydrochloric Acid SCHEMBL8476099 | 0.66 | SMN1; SMN2 (0.97) | SMN1; SMN2ESR2QDPRESR1KMT2A | |
| SCHEMBL24839989 | 0.62 | SMN1; SMN2 (0.46) | SMN1; SMN2ESR2QDPRESR1MEN1 | |
| SCHEMBL5077540 | 0.62 | SMN1; SMN2 (0.46) | SMN1; SMN2ESR2QDPRESR1MEN1 | |
| Cyclohexane SCHEMBL6426374 | 0.60 | ESR1 (0.69) | SMN1; SMN2ESR2ESR1MEN1NPC1 | |
| Hydroquinone SCHEMBL4071158 | 0.59 | ALOX15 (0.80) | SMN1; SMN2ESR2ESR1MEN1NPC1 | |
| Hydroquinone SCHEMBL4309201 | 0.59 | ALOX15 (0.80) | SMN1; SMN2ESR2ESR1MEN1NPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1290058-A2 | PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-03-12 | — | — | EP | claimed |
| WO-2001088013-A2 | PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM | DOW GLOBAL TECHNOLOGIES INC (US) | 2001-11-22 | — | — | WO | claimed |
| US-12460048-B2 | Thermoplastic resin composition and formed product | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-04 | — | — | US | disclosed |
| EP-4640743-A1 | ELECTRONIC BOARD MATERIAL, RESIN, AND METHOD FOR PRODUCING RESIN | Idemitsu Kosan Co.,Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-4640742-A1 | ELECTRONIC SUBSTRATE MATERIAL, RESIN, AND METHOD FOR MANUFACTURING RESIN | Idemitsu Kosan Co.,Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-4640741-A1 | ELECTRONIC SUBSTRATE MATERIAL, RESIN AND METHOD FOR PRODUCING RESIN | Idemitsu Kosan Co.,Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-4023698-B1 | THERMOPLASTIC RESIN COMPOSITION AND FORMED PRODUCT | MITSUBISHI CHEM CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| WO-2024135762-A1 | ELECTRONIC BOARD MATERIAL, RESIN, AND METHOD FOR PRODUCING RESIN | 出光興産株式会社 | 2024-06-27 | — | — | WO | disclosed |
| WO-2024135760-A1 | ELECTRONIC SUBSTRATE MATERIAL, RESIN AND METHOD FOR PRODUCING RESIN | 出光興産株式会社 | 2024-06-27 | — | — | WO | disclosed |
| WO-2024135761-A1 | ELECTRONIC SUBSTRATE MATERIAL, RESIN, AND METHOD FOR MANUFACTURING RESIN | 出光興産株式会社 | 2024-06-27 | — | — | WO | disclosed |
| EP-4023698-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE | Mitsubishi Chemical Corporation (JP) | 2022-07-06 | — | — | EP | disclosed |
| US-20220195114-A1 | THERMOPLASTIC RESIN COMPOSITION AND FORMED PRODUCT | MITSUBISHI CHEMICAL CORPORATION (JP) | 2022-06-23 | — | — | US | disclosed |
| CN-114302905-A | Thermoplastic resin composition and molded article | 三菱化学株式会社 | 2022-04-08 | — | — | CN | disclosed |
| WO-2021039970-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE | 三菱ケミカル株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-1985004176-A1 | A PROCESS FOR PREPARAING VINYL ESTER RESINS CONTAINING TRIAZINE OR BOTH TRIAZINE AND OXAZOLINE GROUPS | THE DOW CHEMICAL COMPANY (US) | 1985-09-26 | — | — | WO | disclosed |