⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL707488 | 0.84 | — | — | |
| SCHEMBL28714171 | 0.71 | — | — | |
| SCHEMBL4017943 | 0.71 | — | — | |
| SCHEMBL704052 | 0.70 | — | — | |
| SCHEMBL16497338 | 0.67 | — | — | |
| SCHEMBL705100 | 0.67 | — | — | |
| SCHEMBL703126 | 0.67 | — | — | |
| SCHEMBL9786369 | 0.67 | — | — | |
| SCHEMBL1607972 | 0.67 | — | — | |
| SCHEMBL703815 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8968458-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2015-03-03 | — | — | US | disclosed |
| US-8808446-B2 | Composition for resist underlayer film and process for producing same | JSR CORPORATION (JP) | 2014-08-19 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100151384-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2010-06-17 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090050020-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2009-02-26 | — | — | US | disclosed |
| EP-1855159-A1 | COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME | JSR Corporation (JP) | 2007-11-14 | — | — | EP | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-4541838-A | Fuel compositions | ETHYL CORPORATION (US) | 1985-09-17 | — | — | US | disclosed |