SCHEMBL704342

SCHEMBL704342

CCCC[Si](Cl)(Cl)CCC[Si](Cl)(Cl)CCCC

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.38
LMNA P02545 1/20 0.38
TDP1 Q9NUW8 1/20 0.37
THRB P10828 1/20 0.35
ALDH1A1 P00352 3/20 0.35
TP53 P04637 1/20 0.35
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL187377 0.97 TSHR (0.40) TSHRLMNATDP1THRBALDH1A1
SCHEMBL707007 0.93 TSHR (0.38) TSHRLMNATDP1THRBALDH1A1
SCHEMBL702967 0.93 TSHR (0.38) TSHRLMNATDP1THRBALDH1A1
SCHEMBL2100720 0.90 TSHR (0.35) TSHRLMNATDP1THRBALDH1A1
SCHEMBL11311679 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL18108347 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL18108111 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL133247 0.87 TSHR (0.44) TSHRLMNATDP1THRBALDH1A1
SCHEMBL705897 0.87 TSHR (0.30) TSHRTDP1
SCHEMBL134147 0.84 TSHR (0.50) TSHRLMNATHRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed