SCHEMBL704639

SCHEMBL704639

CCCC[SiH2]OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7657115 0.91
SCHEMBL3173904 0.88 TSHR (0.44)
SCHEMBL2367729 0.88 TSHR (0.44)
SCHEMBL19385575 0.88 TSHR (0.44)
SCHEMBL20636855 0.88 TSHR (0.44)
SCHEMBL8355145 0.88 TSHR (0.44)
SCHEMBL17991922 0.88 TSHR (0.44)
SCHEMBL7789575 0.88
SCHEMBL441896 0.88 TSHR (0.44)
SCHEMBL3751526 0.88 TSHR (0.44)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1743008-A1 TWO-COMPONENT ADHESIVE/SEALANT Henkel Kommanditgesellschaft auf Aktien (DE) 2007-01-17 EP claimed
WO-2005108520-A1 TWO-COMPONENT ADHESIVE/SEALANT HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-11-17 WO claimed
WO-2023152001-A1 PROCESS FOR THE PREPARATION OF ORGANIC SILICON COMPOUNDS BASF SE (DE) 2023-08-17 WO disclosed
EP-4227314-A1 METHOD FOR THE PREPARATION OF ORGANIC SILICON COMPOUNDS BASF SE (DE) 2023-08-16 EP disclosed
CN-114689665-A Semiconductor structure 新唐科技股份有限公司 2022-07-01 CN disclosed
CN-114539665-A Propylene polymer composition and film 住友化学株式会社 2022-05-27 CN disclosed
EP-3947528-A1 SYSTEM FOR PRODUCING A SEALING COMPOUND FOR INSULATING GLASS IGK Isolierglasklebstoffe GmbH (DE) 2022-02-09 EP disclosed
CN-108475713-B Condensation reaction type die bonding agent, LED light-emitting device and manufacturing method thereof 西铁城时计株式会社 2021-06-18 CN disclosed
CN-108463508-B Condensation-reactive polysiloxane composition and cured product 朋诺株式会社 2020-11-03 CN disclosed
WO-2020201287-A1 SYSTEM FOR PRODUCING A SEALING COMPOUND FOR INSULATING GLASS IGK Isolierglasklebstoffe GmbH (DE) 2020-10-08 WO disclosed
CN-106574116-B Curable composition, cured product, method for using curable composition, and optical device 琳得科株式会社 2020-07-14 CN disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
CN-1891757-A Silica film forming material, silica film and method of manufacturing the same FUJITSU LTD (JP) 2007-01-10 CN disclosed
CN-1837221-A Production processes for triorganomonochlorosilanes HOKKO CHEM IND CO (JP) 2006-09-27 CN disclosed
CN-1612886-A Method for producing triorgano-monoalkoxysilanes and method for producing triorgano-monochlorosilanes HOKKO CHEM IND CO (JP) 2005-05-04 CN disclosed
WO-2003072662-A1 METHOD OF PRODUCING ORGANOACYLOXYSILANES ATOFINA (FR) 2003-09-04 WO disclosed
CN-1033511-C Cocatalyst for polymerization of propylene based on silane and monoether APPRYL (FR) 1996-12-11 CN disclosed
EP-0665243-A2 Catalyst for polymerization of olefins and process for polymerization of olefins using the same TOHO TITANIUM CO., LTD. (JP) 1995-08-02 EP disclosed
CN-1062147-A Propylene polymerization promotor based on silane and monoether APPRYL (FR) 1992-06-24 CN disclosed
EP-0125910-B1 PROCESS FOR PRODUCTION OF 4-METHYL-1-PENTENE POLYMER OR COPOLYMER MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1986-10-08 EP disclosed