SCHEMBL704695

SCHEMBL704695

CC(C)(C)[Si](Br)(C(C)(C)C)C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL704241 0.74
SCHEMBL707721 0.70
SCHEMBL8422091 0.70
SCHEMBL1226402 0.70
SCHEMBL17138329 0.70
SCHEMBL5499686 0.67
SCHEMBL8423496 0.64
SCHEMBL8420016 0.64
SCHEMBL8419576 0.64
SCHEMBL8423362 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250060673-A1 DEVELOPMENT STRATEGY FOR HIGH-ABSORBING METAL-CONTAINING PHOTORESISTS LAM RES CORP (US) 2025-02-20 US claimed
WO-2023115023-A1 DEVELOPMENT STRATEGY FOR HIGH-ABSORBING METAL-CONTAINING PHOTORESISTS LAM RESEARCH CORPORATION (US) 2023-06-22 WO claimed
US-20250376758-A1 SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL ASM IP HOLDING BV (NL) 2025-12-11 US disclosed
US-20250060673-A1 DEVELOPMENT STRATEGY FOR HIGH-ABSORBING METAL-CONTAINING PHOTORESISTS LAM RES CORP (US) 2025-02-20 US disclosed
WO-2023115023-A1 DEVELOPMENT STRATEGY FOR HIGH-ABSORBING METAL-CONTAINING PHOTORESISTS LAM RESEARCH CORPORATION (US) 2023-06-22 WO disclosed
CN-113024725-A Curable composition, cured product, (meth) acrylic resin, and compound 东京应化工业株式会社 2021-06-25 CN disclosed
CN-113031399-A Resin composition, cured product, and siloxane-modified (meth) acrylic resin 东京应化工业株式会社 2021-06-25 CN disclosed
CN-104974184-B preparation of silazane Compounds 信越化学工业株式会社 2019-12-06 CN disclosed
EP-2930177-B1 PREPARATION OF SILAZANE COMPOUND SHINETSU CHEMICAL CO (JP) 2018-04-25 EP disclosed
US-9416147-B2 Preparation of silazane compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-16 US disclosed
EP-2930177-A1 Preparation of silazane compound Shin-Etsu Chemical Co., Ltd. (JP) 2015-10-14 EP disclosed
US-20080268264-A1 Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation JSR CORPORATION (JP) 2008-10-30 US disclosed
US-20080038527-A1 Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film Formation JSR CORPORATION (JP) 2008-02-14 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-20070021580-A1 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2007-01-25 US disclosed
EP-1746122-A1 METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION JSR Corporation (JP) 2007-01-24 EP disclosed
EP-1746123-A1 METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION JSR Corporation (JP) 2007-01-24 EP disclosed
US-20070015892-A1 Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film JSR CORPORATION (JP) 2007-01-18 US disclosed
EP-1705206-A1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR Corporation (JP) 2006-09-27 EP disclosed
EP-1705207-A1 METHOD FOR PRODUCING POLYMER, POLYMER, COMPOSITION FOR FORMING INSULATING FILM, METHOD FOR PRODUCING INSULATING FILM, AND INSULATING FILM JSR Corporation (JP) 2006-09-27 EP disclosed