⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6711932 | 0.97 | — | — | |
| SCHEMBL395772 | 0.97 | — | — | |
| SCHEMBL6708512 | 0.97 | — | — | |
| SCHEMBL167211 | 0.97 | — | — | |
| SCHEMBL786809 | 0.97 | — | — | |
| SCHEMBL1639206 | 0.97 | — | — | |
| SCHEMBL6711892 | 0.97 | — | — | |
| SCHEMBL646421 | 0.93 | — | — | |
| SCHEMBL5416215 | 0.91 | — | — | |
| SCHEMBL5419960 | 0.91 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4720163-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2026-04-08 | — | — | EP | disclosed |
| US-20260062519-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | DOW TORAY CO LTD (JP) | 2026-03-05 | — | — | US | disclosed |
| EP-3868833-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC | DOW TORAY CO LTD (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4574910-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | Dow Toray Co., Ltd. (JP) | 2025-06-25 | — | — | EP | disclosed |
| CN-119790108-A | Curable silicone composition, cured product thereof, laminate, and optical device or optical display | 陶氏东丽株式会社 | 2025-04-08 | — | — | CN | disclosed |
| US-20240400827-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. | 2024-12-05 | — | — | US | disclosed |
| WO-2024248900-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2024-12-05 | — | — | WO | disclosed |
| US-20240376347-A1 | CURABLE HOT MELT ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF AND METHOD FOR PRODUCING FILM, ETC. COMPRISING SAME | DOW TORAY CO LTD (JP) | 2024-11-14 | — | — | US | disclosed |
| US-12134717-B2 | Curable silicone composition and cured product of same, multilayer body and method for producing same, and optical device or optical display | DOW TORAY CO., LTD. (JP) | 2024-11-05 | — | — | US | disclosed |
| EP-3683274-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PATTERN FORMING METHOD | DOW TORAY CO LTD (JP) | 2024-10-30 | — | — | EP | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090294922-A1 | ORGANIC SILICON OXIDE FINE PARTICLE AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | PANASONIC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090294726-A1 | ORGANIC SILICON OXIDE FINE PARTICLES AND PREPARATION METHOD THEREOF, POROUS FILM-FORMING COMPOSITION, POROUS FILM AND FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090206034-A1 | MODIFIED SILICA GEL AND USE THEREOF | DAISO CO., LTD. (JP) | 2009-08-20 | — | — | US | disclosed |
| US-7312013-B2 | Photoreactive composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-12-25 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20040202956-A1 | a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-10-14 | — | — | US | disclosed |
| EP-1391476-A1 | PHOTOREACTIVE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-02-25 | — | — | EP | disclosed |
| US-20040028978-A1 | Proton conducting membrane, method for producing the same, and fuel cell using the same | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2004-02-12 | — | — | US | disclosed |
| EP-1334993-A2 | Proton conducting membrane, method for producing the same, and fuel cell using the same | National Institute of Advanced Industrial Science and Technology (JP) | 2003-08-13 | — | — | EP | disclosed |