SCHEMBL786809

SCHEMBL786809

CO[Si](C)(CCCCCC[Si](C)(OC)OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6708512 1.00
SCHEMBL6711892 1.00
SCHEMBL167211 1.00
SCHEMBL6711932 1.00
SCHEMBL395772 1.00
SCHEMBL1639206 1.00
SCHEMBL704740 0.97
SCHEMBL5412642 0.91
SCHEMBL5417032 0.91
SCHEMBL5421315 0.91

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3187558-B1 MOISTURE CURABLE SILYLATED POLYMER COMPOSITIONS CONTAINING REACTIVE MODIFIERS MOMENTIVE PERFORMANCE MAT INC (US) 2021-03-24 EP claimed
EP-3187558-A1 MOISTURE CURABLE SILYLATED POLYMER COMPOSITIONS CONTAINING REACTIVE MODIFIERS Momentive Performance Materials Inc. (US) 2017-07-05 EP claimed
EP-2424949-B1 MOISTURE CURABLE SILYLATED POLYMER COMPOSITIONS CONTAINING REACTIVE MODIFIERS MOMENTIVE PERFORMANCE MAT INC (US) 2017-03-01 EP claimed
US-8809479-B2 Moisture curable silylated polymer compositions containing reactive modifiers MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2014-08-19 US claimed
EP-4733041-A1 METHOD FOR PRODUCING THREE-DIMENSIONAL (3D) MOLDED ARTICLE USING ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND THREE-DIMENSIONAL (3D) MOLDED ARTICLE PRODUCED USING SAID METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-29 EP disclosed
EP-4720163-A1 SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION GELEST, INC. (US) 2026-04-08 EP disclosed
US-20260062519-A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY DOW TORAY CO LTD (JP) 2026-03-05 US disclosed
US-20260022209-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2026-01-22 US disclosed
EP-4683006-A1 POROUS SILICON CARBIDE COMPOSITE MATERIAL, ELECTRODE FOR FUEL CELL, AND METHOD FOR MANUFACTURING POROUS SILICON CARBIDE COMPOSITE MATERIAL DIC Corporation (JP) 2026-01-21 EP disclosed
EP-4683005-A1 ELECTRODE CATALYST CONTAINING POROUS SILICON CARBIDE COMPOSITE MATERIAL, ELECTRODE FOR ELECTRODE CATALYST, FUEL CELL, AND MANUFACTURING METHOD OF ELECTRODE CATALYST DIC Corporation (JP) 2026-01-21 EP disclosed
US-12454615-B2 Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure DOW TORAY CO., LTD. (JP) 2025-10-28 US disclosed
EP-3868833-B1 CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC DOW TORAY CO LTD (JP) 2025-09-03 EP disclosed
US-20040216641-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed
US-20040219372-A1 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-11-04 US disclosed
US-20040202956-A1 a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films SEKISUI CHEMICAL CO., LTD. (JP) 2004-10-14 US disclosed
CN-1536023-A Porous membrane shaping composition, preparation method of porous membrane, porous membrane intercalation insulating film and semiconductor device ��Խ��ѧ��ҵ��ʽ���� 2004-10-13 CN disclosed
EP-1391476-A1 PHOTOREACTIVE COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2004-02-25 EP disclosed
US-20040028978-A1 Proton conducting membrane, method for producing the same, and fuel cell using the same NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2004-02-12 US disclosed
EP-1334993-A2 Proton conducting membrane, method for producing the same, and fuel cell using the same National Institute of Advanced Industrial Science and Technology (JP) 2003-08-13 EP disclosed
US-6372398-B1 PREPARING A SILICON-CONTAINING COATING AGENT CONTAINING HYDROLYTIC SILICON COMPOUNDS AND A HYDROLYTIC SILICON COMPOUND HAVING REACTIVE GROUP WHICH HAS BEEN EXCHANGED WITH SUBSTITUENT OF PROTECTIVE GROUP PRECURSOR; COATING AND CURING FUJI XEROX CO., LTD. (JP) 2002-04-16 US disclosed