SCHEMBL704794

SCHEMBL704794

CCCC[Si](Cl)(CCCC)CCC[Si](Cl)(CCCC)CCCC

nearest known ligand 0.38

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.38
LMNA P02545 1/20 0.38
TDP1 Q9NUW8 1/20 0.37
THRB P10828 1/20 0.35
ALDH1A1 P00352 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL348204 0.97 TSHR (0.40) TSHRLMNATDP1THRBALDH1A1
Ammonia Solution, Strong SCHEMBL27832272 0.93 TSHR (0.38) TSHRLMNATDP1THRBALDH1A1
SCHEMBL703090 0.93 TSHR (0.38) TSHRLMNATDP1THRBALDH1A1
SCHEMBL706714 0.93 TSHR (0.38) TSHRLMNATDP1THRBALDH1A1
SCHEMBL3482229 0.90 TSHR (0.35) TSHRLMNATDP1THRBALDH1A1
SCHEMBL2273982 0.90 TSHR (0.35) TSHRLMNATDP1THRBALDH1A1
SCHEMBL25338689 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL18108495 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL7755459 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1
SCHEMBL18108168 0.88 TSHR (0.47) TSHRLMNATHRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed