SCHEMBL7048848

SCHEMBL7048848

Nc1ccc(S(=O)(=O)c2ccc(NC(=O)c3cccc(C(=O)Nc4ccc(S(=O)(=O)c5ccc(N)cc5)cc4)c3)cc2)cc1

nearest known ligand 0.81

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRMT1 Q99873 4/20 0.81
CYP3A4 P08684 1/20 0.69
CYP2C9 P11712 1/20 0.69
SETD7 Q8WTS6 1/20 0.68
PTGS1 P23219 1/20 0.63
KMT2A Q03164 5/20 0.63
MEN1 O00255 4/20 0.63
HPGD P15428 1/20 0.63
CA12 O43570 2/20 0.61
CA1 P00915 2/20 0.61
CA2 P00918 2/20 0.61
CA9 Q16790 2/20 0.61
PKM P14618 2/20 0.60
CYP2C19 P33261 1/20 0.60
LMNA P02545 2/20 0.57
POLB P06746 1/20 0.57
APEX1 P27695 1/20 0.57
TDP1 Q9NUW8 1/20 0.57
TP53 P04637 1/20 0.55
KDM4E B2RXH2 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6082893 0.89 MEN1 (0.71) PRMT1PTGS1KMT2AMEN1CA12
SCHEMBL9320382 0.87 PRMT1 (0.69) PRMT1CYP3A4CYP2C9SETD7PTGS1
SCHEMBL10528203 0.84 PTGS1 (0.62) PRMT1CYP3A4CYP2C9SETD7PTGS1
SCHEMBL9746979 0.83 PTGS1 (0.64) PRMT1PTGS1KMT2AMEN1PKM
SCHEMBL309467 0.82 PTGS1 (0.72) PRMT1PTGS1KMT2AMEN1PKM
SCHEMBL31171945 0.82 PTGS1 (0.72) PRMT1PTGS1KMT2AMEN1PKM
SCHEMBL14679077 0.82 CYP3A4 (1.00) PRMT1CYP3A4CYP2C9SETD7KMT2A
SCHEMBL9320331 0.82 PRMT1 (0.64) PRMT1CYP3A4CYP2C9SETD7KMT2A
SCHEMBL22826277 0.81 PTGS1 (0.65) PTGS1KMT2AMEN1PKMLMNA
SCHEMBL10797525 0.81 PTGS1 (0.62) PRMT1CYP3A4CYP2C9PTGS1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0957400-B1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN THEREFROM, ELECTRONIC DEVICES PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCTION THEREOF HITACHI CHEMICAL CO LTD (JP) 2003-04-16 EP disclosed
US-6291619-B1 HEAT RESISTANCE HITACHI CHEMICAL CO., LTD (JP) 2001-09-18 US disclosed
EP-0957400-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN THEREFROM, ELECTRONIC DEVICES PRODUCED BY USING THE SAME, AND METHOD FOR PRODUCTION THEREOF HITACHI CHEMICAL CO., LTD. (JP) 1999-11-17 EP disclosed