SCHEMBL7049136

SCHEMBL7049136

CO[SiH](OC)OC.NCC1CNC1

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
NCF1 P14598 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8817050 0.83
SCHEMBL539231 0.80
Hydrochloric Acid SCHEMBL7012632 0.77
SCHEMBL9578352 0.72
SCHEMBL11615373 0.69 EPHX2 (0.37) NCF1
SCHEMBL2918258 0.69
SCHEMBL7045192 0.67 GBA1 (0.30)
SCHEMBL37542 0.67 SLC6A4 (0.31)
Hydrochloric Acid SCHEMBL23581434 0.65 SLC6A4 (0.30)
SCHEMBL1996565 0.65 KCNH2 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2695910-B1 Color-changeable organopolysiloxane composition and structural material adhered by the composition SHINETSU CHEMICAL CO (JP) 2017-05-24 EP disclosed
EP-2695910-A1 Color-changeable organopolysiloxane composition and structural material adhered by the composition Shin-Etsu Chemical Co., Ltd. (JP) 2014-02-12 EP disclosed
CN-103170311-A Novel amino serial chromatographic support and preparation method UNIV EAST CHINA SCIENCE & TECH 2013-06-26 CN disclosed
US-6657008-B2 Styrenic polymer with syndiotactic configuration, thermoplastic resin with reactive polar group, compatibilizing agent, flame retardant, and auxiliary; construction materials IDEMITSU KOSAN CO., LTD. (JP) 2003-12-02 US disclosed
EP-0758840-B1 COPPER FOIL AND HIGH-DENSITY MULTI-LAYERED PRINTED CIRCUIT BOARD USING THE COPPER FOIL FOR INNER LAYER CIRCUIT MITSUI MINING & SMELTING CO (JP) 2003-04-09 EP disclosed
EP-0771833-B1 PROCESS OF PRODUCING ACID-MODIFIED POLYPHENYLENE ETHER AND POLYSTYRENIC RESIN COMPOSITION IDEMITSU PETROCHEMICAL CO (JP) 2002-11-06 EP disclosed
US-20020103298-A1 FLAME RETARDANT RESIN COMPOSITION IDEMITSU KOSAN CO., LTD. (JP) 2002-08-01 US disclosed
US-20020035208-A1 Flame retardant resin composition IDEMITSU KOSAN CO., LTD. (JP) 2002-03-21 US disclosed
US-5952431-A MODIFYING POLYPHENYLENE ETHER WITH FUMARIC ACID OR A DERIVATIVE OF FUMARIC ACID IN THE ABSENCE OF SOLVENTS AND RADICAL GENERATING AGENT HAVING A HALF-LIFE OF 1 MINUTE AT A TEMPERATURE OF 300.DEGREE. C. OR HIGHER IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1999-09-14 US disclosed
EP-0823455-B1 FLAME-RETARDANT RESIN COMPOSITION IDEMITSU KOSAN CO (JP) 1999-09-08 EP disclosed
US-5760105-A CONSISTING OF SYNDIOTACTIC STYRENIC POLYMER, THERMOPLASTIC RESIN, RUBBERY ELASTOMER AND COMPATIBILIZER; RIGIDITY, HEAT, IMPACT AMD WATER RESISTANCE; ELECTRONICS, AUTO PARTS, CONSTRUCTION MATERIALS IDEMITSU KOSAN CO., LTD. (JP) 1998-06-02 US disclosed
EP-0823455-A1 FLAME-RETARDANT RESIN COMPOSITION IDEMITSU KOSAN COMPANY LIMITED (JP) 1998-02-11 EP disclosed
EP-0771833-A1 PROCESS OF PRODUCING ACID-MODIFIED POLYPHENYLENE ETHER AND POLYSTYRENIC RESIN COMPOSITION IDEMITSU PETROCHEMICAL CO., LTD. (JP) 1997-05-07 EP disclosed
EP-0758840-A1 COPPER FOIL AND HIGH-DENSITY MULTI-LAYERED PRINTED CIRCUIT BOARD USING THE COPPER FOIL FOR INNER LAYER CIRCUIT MITSUI MINING & SMELTING CO., LTD. (JP) 1997-02-19 EP disclosed
US-4352878-A INCLUSION OF DIHYDRIC ALCOHOL IN COATING COMPOSITION TO RETARD DRYING HITACHI, LTD. (JP) 1982-10-05 US disclosed
US-4254197-A BIS-AZIDE PHOTOCROSSLINKER, POLYMER, DIHYDRIC ALCOHOL FLUIDIZER HITACHI, LTD. (JP) 1981-03-03 US disclosed