SCHEMBL7050702

SCHEMBL7050702

Nc1ccc(C2(c3ccc(N)cc3)c3ccccc3-c3ccc(F)cc32)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.71
LMNA P02545 2/20 0.71
MAPT P10636 2/20 0.71
SMN1; SMN2 Q16637 2/20 0.71
MEN1 O00255 2/20 0.71
KMT2A Q03164 2/20 0.71
OPRK1 P41145 1/20 0.71
PDK2 Q15119 7/20 0.47
POLB P06746 2/20 0.41
ESR1 P03372 1/20 0.41
ESR2 Q92731 1/20 0.41
KIF11 P52732 1/20 0.37
TAAR1 Q96RJ0 1/20 0.36
NPC1 O15118 1/20 0.35
ALDH1A1 P00352 1/20 0.35
HPGD P15428 1/20 0.35
RAB9A P51151 1/20 0.35
GPR3 P46089 1/20 0.35
AKR1A1 P14550 1/20 0.34
AKR1B1 P15121 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29579819 1.00 KDM4E (0.71) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL27043762 0.92 LMNA (0.55) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL13645436 0.86 PDK2 (0.53) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL2450310 0.86 SMN1; SMN2 (0.81) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL29426418 0.84 MAPT (1.00) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL105428 0.84 MAPT (1.00) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL29392989 0.84 MAPT (1.00) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL9171544 0.84 PDK2 (0.51) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL27043602 0.83 MEN1 (0.46) KDM4ELMNAMAPTSMN1; SMN2MEN1
SCHEMBL27043772 0.83 AKR1B1 (0.47) KDM4ELMNAMAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-20240024828-A1 HALOGEN-SUBSTITUTED 9,9-BIS(4-AMINOPHENYL)FLUORENE BASED POLYIMIDE MEMBRANES FOR GAS SEPARATION APPLICATIONS SAUDI ARABIAN OIL COMPANY (SA) 2024-01-25 US disclosed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
US-11111333-B2 Resin compositions and resin infusion process CYTEC INDUSTRIES INC. (US) 2021-09-07 US disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed