⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12264073 | 0.87 | — | — | |
| SCHEMBL17498474 | 0.86 | — | — | |
| SCHEMBL2614820 | 0.86 | — | — | |
| SCHEMBL9356569 | 0.83 | — | — | |
| SCHEMBL16850567 | 0.83 | — | — | |
| SCHEMBL19702987 | 0.83 | — | — | |
| SCHEMBL13647426 | 0.81 | — | — | |
| SCHEMBL13647425 | 0.79 | NFKB1 (0.33) | — | |
| SCHEMBL13039002 | 0.78 | — | — | |
| SCHEMBL18327991 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 113 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12319814-B2 | Polyamideimide resin, resin composition, and semiconductor device | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| EP-4365237-A1 | RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-05-08 | — | — | EP | disclosed |
| WO-2024039914-A1 | SORBENTS FUNCTIONALIZED WITH LIGANDS HAVING AN AMINOSILICONE FUNCTIONAL GROUP | GENERAL ELECTRIC TECHNOLOGY GMBH (CH) | 2024-02-22 | — | — | WO | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4026867-B1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-12-06 | — | — | EP | disclosed |
| US-11687002-B2 | Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device | LG CHEM, LTD. (KR) | 2023-06-27 | — | — | US | disclosed |
| US-11687002-B2 | Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device | LG CHEM, LTD. (KR) | 2023-06-27 | — | — | US | disclosed |
| US-20230000993-A1 | SILICON BASED DRUG CONJUGATES AND METHODS OF USING SAME | BLINKBIO INC (US) | 2023-01-05 | — | — | US | disclosed |
| US-20220332947-A1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-10-20 | — | — | US | disclosed |
| WO-2022185718-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-09-09 | — | — | WO | disclosed |
| US-6159654-A | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-12-12 | — | — | US | disclosed |
| US-6001517-A | A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-14 | — | — | US | disclosed |
| EP-0634673-B1 | Ocular lens material | MENICON CO LTD (JP) | 1999-10-20 | — | — | EP | disclosed |
| US-5756650-A | COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-05-26 | — | — | US | disclosed |
| US-5703143-A | SILICON-CONTAINING POLYPHENYLENE ETHER POLYMER | MENICON CO., LTD. (JP) | 1997-12-30 | — | — | US | disclosed |
| US-5605942-A | POLYIMIDE HAVING EXCELLENT TRANSPARENCY, OXYGEN PERMEABILITY, HEAT RESISTANCE, ULTRAVIOLET LIGHT ABSORPTION | MENICON CO., LTD. (JP) | 1997-02-25 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |
| EP-0725284-A2 | Ocular lens material | Menicon Co., Ltd. (JP) | 1996-08-07 | — | — | EP | disclosed |
| US-5543442-A | POLYIMIDESILOXANE COPOLYMER | MENICON CO., LTD. (JP) | 1996-08-06 | — | — | US | disclosed |
| EP-0634673-A1 | Ocular lens material | Menicon Co., Ltd. (JP) | 1995-01-18 | — | — | EP | disclosed |