SCHEMBL7051991

SCHEMBL7051991

CNc1ccc(C2(c3ccc(NC)cc3)c3ccccc3-c3ccc(C(C)(C)C)cc32)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDK2 Q15119 8/20 0.45
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
KDM4E B2RXH2 1/20 0.41
LMNA P02545 1/20 0.41
MAPT P10636 1/20 0.41
OPRK1 P41145 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
NPC1 O15118 1/20 0.40
ALDH1A1 P00352 1/20 0.40
PLA2G1B P04054 1/20 0.40
NFKB1 P19838 1/20 0.40
CASP3 P42574 1/20 0.40
RAB9A P51151 1/20 0.40
NFKB2 Q00653 1/20 0.40
RELA Q04206 1/20 0.40
SENP8 Q96LD8 1/20 0.40
SENP7 Q9BQF6 1/20 0.40
SENP6 Q9GZR1 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29579557 1.00 PDK2 (0.45) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL24060811 0.85 ALDH1A1 (0.46) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL6538799 0.83 MEN1 (0.57) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL30771578 0.83 MEN1 (0.57) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL9772987 0.83 ESR1 (0.48) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL23567189 0.83 MAPT (0.65) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL19934339 0.82 ALDH1A1 (0.52) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL21215242 0.82 ALDH1A1 (0.52) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL30421958 0.82 ALDH1A1 (0.52) PDK2MEN1KMT2AKDM4ELMNA
SCHEMBL25858113 0.82 ALDH1A1 (0.52) PDK2MEN1KMT2AKDM4ELMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-11111333-B2 Resin compositions and resin infusion process CYTEC INDUSTRIES INC. (US) 2021-09-07 US disclosed
US-11078358-B2 Curable composition including epoxy resin and curable solid filler 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-08-03 US disclosed
EP-3814398-A1 CURABLE COMPOSITIONS AND RELATED METHODS 3M Innovative Properties Company (US) 2021-05-05 EP disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed