⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13089244 | 0.83 | — | — | |
| SCHEMBL13089237 | 0.83 | — | — | |
| SCHEMBL13089230 | 0.81 | — | — | |
| SCHEMBL705523 | 0.80 | — | — | |
| SCHEMBL13089240 | 0.79 | TSHR (0.36) | — | |
| SCHEMBL13089209 | 0.79 | — | — | |
| SCHEMBL13089232 | 0.78 | ADRB2 (0.30) | — | |
| SCHEMBL4270855 | 0.78 | — | — | |
| SCHEMBL13089164 | 0.77 | — | — | |
| SCHEMBL13089218 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10025188-B2 | Resist pattern-forming method | JSR CORPORATION (JP) | 2018-07-17 | — | — | US | disclosed |
| US-20170322492-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2017-11-09 | — | — | US | disclosed |
| US-20160320705-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2016-11-03 | — | — | US | disclosed |
| US-9434609-B2 | Method for forming pattern, and polysiloxane composition | JSR CORPORATION (JP) | 2016-09-06 | — | — | US | disclosed |
| US-9329478-B2 | Polysiloxane composition and pattern-forming method | JSR CORPORATION (JP) | 2016-05-03 | — | — | US | disclosed |
| US-20160097978-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2016-04-07 | — | — | US | disclosed |
| US-9126231-B2 | Insulation pattern-forming method and insulation pattern-forming material | JSR CORPORATION (JP) | 2015-09-08 | — | — | US | disclosed |
| US-9116427-B2 | Composition for forming resist underlayer film and pattern-forming method | JSR CORPORATION (JP) | 2015-08-25 | — | — | US | disclosed |
| US-20150160556-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2015-06-11 | — | — | US | disclosed |
| US-8993223-B2 | Resist pattern-forming method | JSR CORPORATION (JP) | 2015-03-31 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090292075-A1 | CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL | KANEKA CORPORATION (JP) | 2009-11-26 | — | — | US | disclosed |
| US-7601781-B2 | Curable compositions | KANEKA CORPORATION (JP) | 2009-10-13 | — | — | US | disclosed |
| US-20080177001-A1 | CURABLE COMPOSITIONS | KANEKA CORPORATION (JP) | 2008-07-24 | — | — | US | disclosed |
| US-7323519-B2 | Process for producing vinyl polymer, vinyl polymer, and curable composition | KANEKA CORPORATION (JP) | 2008-01-29 | — | — | US | disclosed |
| US-7304108-B2 | Polymer, process for producing the polymer, and curable composition containing the polymer | KANEKA CORPORATION (JP) | 2007-12-04 | — | — | US | disclosed |
| US-20070276066-A1 | Curing Composition | KANEKA CORPORATION (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070135590-A1 | Curable composition and cured product thereof | KANEKA CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20070004880-A1 | Polymer, process for producing the polymer, and curable composition containing the polymer | KANEKA CORPORATION (JP) | 2007-01-04 | — | — | US | disclosed |