SCHEMBL705506

SCHEMBL705506

CC([SiH2]Cl)(c1ccccc1)c1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.44
TSHR P16473 2/20 0.43
MAPT P10636 1/20 0.43
KMT2A Q03164 1/20 0.43
CYP2C19 P33261 1/20 0.41
HIF1A Q16665 1/20 0.41
ALDH1A1 P00352 3/20 0.41
TAAR1 Q96RJ0 1/20 0.41
ALOX15 P16050 1/20 0.41
ESR1 P03372 2/20 0.39
ESR2 Q92731 2/20 0.39
CYP3A4 P08684 1/20 0.39
KCNN4 O15554 3/20 0.39
CYP1A2 P05177 1/20 0.36
CYP2B6 P20813 1/20 0.35
HDAC3 O15379 1/20 0.35
HDAC4 P56524 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC7 Q8WUI4 1/20 0.35
HDAC2 Q92769 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11342153 0.79 MAPK1 (0.44) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL5034188 0.77 TSHR (0.52) TSHRMAPTKMT2AALDH1A1
SCHEMBL707097 0.76 MAPK1 (0.46) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL4855640 0.75 MAPK1 (0.41) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL22730252 0.75 MAPK1 (0.41) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL706961 0.74 KCNN4 (0.44) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL5143306 0.74 MAPT (0.48) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL6892052 0.73 TSHR (0.44) MAPK1TSHRMAPTKMT2ACYP2C19
SCHEMBL5167778 0.72 TSHR (0.48) MAPK1TSHRCYP2C19HIF1AALDH1A1
SCHEMBL10448326 0.72 CYP2C19 (0.41) MAPK1TSHRMAPTKMT2ACYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
CN-103249762-A Addition-curable metallosiloxane compound DAICEL CORP 2013-08-14 CN disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
CN-100535054-C Silica film forming material, silica film and preparation method thereof FUJITSU LTD (JP) 2009-09-02 CN disclosed
US-7572303-B2 A symmetrical dialkyl carbonate, a metal, borong, silicon, or group 7 compound, a hydrogen or hydrocarbon-based fuel, an oxidizer, and a metallic cocatalyst; minimized hydrolysis; improved combustion and storage stability OCTANE INTERNATIONAL, LTD. (US) 2009-08-11 US disclosed
WO-1997016466-A1 POLYURETHANE (METH)ACRYLATES AND PROCESSES FOR PREPARING SAME UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1997-05-09 WO disclosed
US-5362519-A Polyesters particularly suitable for use in coating compositions which are sprayed with compressed fluids as vicosity reducing agents UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1994-11-08 US disclosed
US-5248752-A Improved moisture resistance, inks, coatings, sealants, adhesives UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-09-28 US disclosed
EP-0545110-A1 Polyesters for coating compositions which are sprayed with compressed fluids as viscosity reducing diluents UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-06-09 EP disclosed
EP-0545108-A1 Polyesters of branched aliphatic diols UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-06-09 EP disclosed
EP-0542220-A1 Polyurethanes and processes for preparing same UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-05-19 EP disclosed
EP-0542219-A2 Polyurethane (meth)acrylates and processes for preparing same UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-05-19 EP disclosed
EP-0542217-A2 Substituted 1,5-pentanediols and processes for the preparation thereof UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-05-19 EP disclosed
EP-0542218-A1 Conformal coating compositions UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION (US) 1993-05-19 EP disclosed
CN-1072168-A 1 of replacement, 5-pentanediol and preparation method UNION CARBIDE CHEM PLASTIC (US) 1993-05-19 CN disclosed