SCHEMBL7055911

SCHEMBL7055911

Nc1ccc(C2(c3ccc(N)cc3)c3ccccc3-c3c(Cl)cccc32)cc1

nearest known ligand 0.66

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.66
KMT2A Q03164 2/20 0.66
KDM4E B2RXH2 1/20 0.66
LMNA P02545 1/20 0.66
MAPT P10636 1/20 0.66
OPRK1 P41145 1/20 0.66
SMN1; SMN2 Q16637 1/20 0.66
PDK2 Q15119 9/20 0.46
POLB P06746 2/20 0.41
PLA2G7 Q13093 1/20 0.36
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
MDM2 Q00987 1/20 0.34
ADORA2A P29274 1/20 0.33
TGM2 P21980 1/20 0.32
NR4A2 P43354 1/20 0.32
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29581020 1.00 MEN1 (0.66) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL15551320 0.86 PDK2 (0.51) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL30018652 0.86 PDK2 (0.51) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29579466 0.82 MAPT (0.68) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL4660239 0.82 MEN1 (0.68) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL7047354 0.82 MAPT (0.68) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL19148112 0.81 PDK2 (0.56) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL30018949 0.81 PDK2 (0.56) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL29786806 0.81 PDK2 (0.56) MEN1KMT2AKDM4ELMNAMAPT
SCHEMBL105428 0.80 MAPT (1.00) MEN1KMT2AKDM4ELMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
EP-2900726-A2 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN Hexcel Composites Limited (GB) 2015-08-05 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-20210292545-A1 PREPREG TORAY INDUSTRIES, INC. (JP) 2021-09-23 US disclosed
US-11111333-B2 Resin compositions and resin infusion process CYTEC INDUSTRIES INC. (US) 2021-09-07 US disclosed
US-11078358-B2 Curable composition including epoxy resin and curable solid filler 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-08-03 US disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed