Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 2/20 | 0.68 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.68 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.68 |
| ▸ | LMNA | P02545 | 1/20 | 0.68 |
| ▸ | MAPT | P10636 | 1/20 | 0.68 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.68 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.68 |
| ▸ | PDK2 | Q15119 | 6/20 | 0.47 |
| ▸ | ESR1 | P03372 | 1/20 | 0.45 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.41 |
| ▸ | HTT | P42858 | 2/20 | 0.35 |
| ▸ | CNR1 | P21554 | 1/20 | 0.35 |
| ▸ | GPR35 | Q9HC97 | 1/20 | 0.35 |
| ▸ | GPR55 | Q9Y2T6 | 1/20 | 0.35 |
| ▸ | CD44 | P16070 | 1/20 | 0.34 |
| ▸ | MYC | P01106 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 1/20 | 0.34 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
| ▸ | CA7 | P43166 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22617847 | 0.88 | PDK2 (0.51) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL29579952 | 0.87 | KDM4E (0.53) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL8750544 | 0.87 | KDM4E (0.53) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL19521771 | 0.84 | PDK2 (0.58) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL14053435 | 0.83 | MEN1 (0.68) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL7055778 | 0.83 | KDM4E (0.58) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL29579672 | 0.83 | KDM4E (0.58) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL7051999 | 0.83 | MEN1 (0.45) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL6297045 | 0.82 | PDK2 (0.56) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL7055911 | 0.82 | MEN1 (0.66) | MEN1KMT2AKDM4ELMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2900726-B1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LTD (GB) | 2020-04-08 | — | — | EP | claimed |
| EP-2900726-A2 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | Hexcel Composites Limited (GB) | 2015-08-05 | — | — | EP | claimed |
| US-20150210847-A1 | RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN | HEXCEL COMPOSITES LIMITED (GB) | 2015-07-30 | — | — | US | claimed |
| EP-4397731-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2024-07-10 | — | — | EP | disclosed |
| CN-111295407-B | Resin composition and resin infusion method | 塞特工业公司 | 2023-06-27 | — | — | CN | disclosed |
| WO-2023032888-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11370908-B2 | Curable compositions and related methods | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2022-06-28 | — | — | US | disclosed |
| CN-110114384-B | Curable composition | 3M创新有限公司 | 2022-06-07 | — | — | CN | disclosed |
| CN-110734736-B | Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same | 东丽株式会社 | 2022-04-19 | — | — | CN | disclosed |
| US-20220080553-A1 | RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR | 3M INNOVATIVE PROPERTIES CO (US) | 2022-03-17 | — | — | US | disclosed |
| US-20220001514-A1 | ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS | 3M INNOVATIVE PROPERTIES COMPANY | 2022-01-06 | — | — | US | disclosed |
| EP-0591313-B1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS | MINNESOTA MINING & MFG (US) | 1997-04-02 | — | — | EP | disclosed |
| WO-1997011112-A1 | EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1997-03-27 | — | — | WO | disclosed |
| US-5432010-A | Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1995-07-11 | — | — | US | disclosed |
| US-5369192-A | Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1994-11-29 | — | — | US | disclosed |
| EP-0591313-A1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. | MINNESOTA MINING & MFG (US) | 1994-04-13 | — | — | EP | disclosed |
| WO-1993000675-A1 | VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1993-01-07 | — | — | WO | disclosed |
| EP-0203828-B1 | EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1990-03-28 | — | — | EP | disclosed |
| US-4684678-A | POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1987-08-04 | — | — | US | disclosed |
| EP-0203828-A1 | Epoxy resin curing agent, curing process and composition containing it | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1986-12-03 | — | — | EP | disclosed |