⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL505237 | 0.70 | — | — | |
| SCHEMBL11304502 | 0.69 | — | — | |
| SCHEMBL8846733 | 0.69 | — | — | |
| SCHEMBL707000 | 0.64 | — | — | |
| SCHEMBL251798 | 0.64 | — | — | |
| SCHEMBL18431078 | 0.64 | — | — | |
| SCHEMBL7039492 | 0.64 | — | — | |
| SCHEMBL16553510 | 0.64 | — | — | |
| SCHEMBL12228801 | 0.63 | — | — | |
| SCHEMBL12971280 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | claimed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | claimed |
| US-20250357107-A1 | RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITY | APPLIED MATERIALS, INC. (US) | 2025-11-20 | — | — | US | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| WO-2025038375-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND INCREASED DENSITY | APPLIED MATERIALS, INC. (US) | 2025-02-20 | — | — | WO | claimed |
| WO-2024238097-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS WITH INCREASED ETCH SELECTIVITY | APPLIED MATERIALS, INC. (US) | 2024-11-21 | — | — | WO | claimed |
| WO-2024226342-A1 | METHODS FOR FORMING LOW-Κ DIELECTRIC MATERIALS | APPLIED MATERIALS, INC. (US) | 2024-10-31 | — | — | WO | claimed |
| CN-118546527-A | Preparation method of modified organic silicon composition | 南京瑞思化学技术有限公司 | 2024-08-27 | — | — | CN | claimed |
| CN-114316299-B | Method for improving stability of organosilicon emulsion | 南京瑞思化学技术有限公司 | 2024-08-13 | — | — | CN | claimed |
| WO-2015132577-A1 | PYRIDINE DERIVATIVES AND METHODS OF USE | LINK TECHNOLOGIES LIMITED (GB) | 2015-09-11 | — | — | WO | claimed |
| US-20260018409-A1 | POST TREATMENT PROCESSES | APPLIED MATERIALS INC (US) | 2026-01-15 | — | — | US | disclosed |
| WO-2025264567-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS, INC. (US) | 2025-12-26 | — | — | WO | disclosed |
| US-20250391656-A1 | LOW-K FILM COEFFICIENT OF THERMAL EXPANSION MODULATION BY UV TREATMENT | APPLIED MATERIALS INC (US) | 2025-12-25 | — | — | US | disclosed |
| US-20250369102-A1 | LOWER K AND HIGHER HARDNESS WITH IMPROVED PLASMA INDUCED DAMAGE (PID) DIELECTRIC FILM DEPOSITION | APPLIED MATERIALS INC (US) | 2025-12-04 | — | — | US | disclosed |
| US-20060285194-A1 | Display medium, display device and display method using the display medium | FUJI XEROX CO., LTD. | 2006-12-21 | — | — | US | disclosed |
| US-20060285195-A1 | Display medium, display device and display method using the display medium | FUJI XEROX CO., LTD. | 2006-12-21 | — | — | US | disclosed |
| CN-1289536-C | Oleifin polymerization catalyst, catalyst component for olefin polymerization, method of storing these, and process for producing olefin polymer | SUNALLOMER LTD (JP) | 2006-12-13 | — | — | CN | disclosed |
| WO-2006038735-A1 | RESIN COMPOSITION FOR OPTICAL PACKAGING MATERIAL AND PROCESS FOR PREPARING THE SAME, AND OPTICAL PACKAGING MATERIAL, OPTICAL PACKAGING COMPONENT, AND OPTICAL MODULE | NIPPON SHOKUBAI CO., LTD. (JP) | 2006-04-13 | — | — | WO | disclosed |
| CN-1481394-A | Olefin polymerization catalyst, olefin polymerization catalyst component and method for storing the same, and process for producing olefin polymer | 胜亚诺盟股份有限公司 | 2004-03-10 | — | — | CN | disclosed |