SCHEMBL7058738

SCHEMBL7058738

[Ag].[Bi].[Co].[Cu].[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10938993 0.89
SCHEMBL7063528 0.89
SCHEMBL15546796 0.80
SCHEMBL31065339 0.80
SCHEMBL16583531 0.78
SCHEMBL216690 0.78
SCHEMBL2302193 0.78
SCHEMBL1414499 0.78
SCHEMBL3126034 0.78
SCHEMBL11841216 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2003041464-A2 IMPROVED EPOXY FORMULATION ADAPTED TO BE USED IN CONJUNCTION WITH NO-LEAD SOLDER IN ELECTRONIC COMPONENTS BOURNS, INC. (US) 2003-05-15 WO disclosed
US-6548576-B1 Bisphenol A diglycidyl ether polyepoxide; phenol-formaldehyde resin; o-cresol, glycidyl ether; polyoxypropylene glycol glycidyl ether; cycloaliphatic polyamine; kaolin clay, magnesium aluminum silicate, antimony oxide, and alumina BOURNS, INC. 2003-04-15 US disclosed