SCHEMBL705976

SCHEMBL705976

CCC[SiH](F)CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23701161 0.87
SCHEMBL23701183 0.85
SCHEMBL706176 0.75
SCHEMBL7202178 0.72
SCHEMBL23701007 0.65
SCHEMBL5616763 0.65
SCHEMBL23701346 0.65
SCHEMBL23700995 0.65
SCHEMBL8384938 0.64 LMNA (0.31)
SCHEMBL126009 0.64 LMNA (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12371447-B2 Method for producing (meth)acryloxy group-containing organosilicon compounds SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-29 US disclosed
EP-4174076-B1 METHOD FOR PRODUCING (METH)ACRYLOXY GROUP-CONTAINING ORGANOSILICON COMPOUNDS SHINETSU CHEMICAL CO (JP) 2024-07-24 EP disclosed
US-11807758-B2 Siloxane polymer and method of producing siloxane polymer JNC CORPORATION (JP) 2023-11-07 US disclosed
US-20230134471-A1 METHOD FOR PRODUCING (METH)ACRYLOXY GROUP-CONTAINING ORGANOSILICON COMPOUNDS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-04 US disclosed
EP-4174076-A1 METHOD FOR PRODUCING (METH)ACRYLOXY GROUP-CONTAINING ORGANOSILICON COMPOUNDS Shin-Etsu Chemical Co., Ltd. (JP) 2023-05-03 EP disclosed
CN-116041382-A Method for producing organosilicon compounds containing (meth) acryloxy groups 信越化学工业株式会社 2023-05-02 CN disclosed
CN-114207901-A Nonaqueous electrolyte solution and nonaqueous electrolyte battery 三菱化学株式会社 2022-03-18 CN disclosed
US-20210238419-A1 SILOXANE POLYMER AND METHOD OF PRODUCING SILOXANE POLYMER JNC CORPORATION (JP) 2021-08-05 US disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
CN-105392845-B Photocurable composition 思美定株式会社 2020-10-20 CN disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-20160152783-A1 PHOTOCURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2016-06-02 US disclosed
EP-3023462-A1 PHOTOCURABLE COMPOSITION Cemedine Co., Ltd. (JP) 2016-05-25 EP disclosed
US-8791221-B2 Addition-curable metallosiloxane compound DAICEL CORPORATION (JP) 2014-07-29 US disclosed
EP-2650319-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND Daicel Corporation (JP) 2013-10-16 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
US-8124690-B2 Moisture curable polymer having SiF group, and curable composition containing the same KANEKA CORPORATION (JP) 2012-02-28 US disclosed
US-20090275702-A1 MOISTURE CURABLE POLYMER HAVING SiF GROUP, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-11-05 US disclosed
EP-2062929-A1 MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME Kaneka Corporation (JP) 2009-05-27 EP disclosed