SCHEMBL7065553

SCHEMBL7065553

C=CCSC1=CC=CCC1=O

nearest known ligand 0.32

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.32
POLB P06746 2/20 0.32
RECQL P46063 1/20 0.32
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
ALOX15 P16050 1/20 0.31
KMT2A Q03164 1/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18892677 0.69
SCHEMBL1797594 0.68 KDM4E (0.31)
SCHEMBL10939008 0.66
SCHEMBL6048050 0.65
SCHEMBL11460040 0.62
SCHEMBL18602064 0.61
SCHEMBL934474 0.61
SCHEMBL3360734 0.61
SCHEMBL11666449 0.60 ALDH1A1 (0.32) MAPTRECQLMEN1ALDH1A1ALOX15
SCHEMBL3118880 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040063804-A1 A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and exhibits a satisfactorily high bonding property, even under low- dose irradiation. The thermosetting adhesive contains an 3M INNOVATIVE PROPERTIES COMPANY 2004-04-01 US disclosed
EP-1373427-A2 THERMOSETTING ADHESIVE 3M Innovative Properties Company (US) 2004-01-02 EP disclosed
WO-2002079338-A2 THERMOSETTING ADHESIVE 3M INNOVATIVE PROPERTIES COMPANY (US) 2002-10-10 WO disclosed