Boric Acid

Boric Acid

SCHEMBL7071985

CC(c1ccccc1)N(C)C.OB(O)O

nearest known ligand 0.53

Full drug profile on Sugi Atlas →

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.53
MAPT P10636 1/20 0.53
CYP2C9 P11712 1/20 0.53
KMT2A Q03164 1/20 0.53
KDM4E B2RXH2 2/20 0.52
ALDH1A1 P00352 1/20 0.52
ALOX5 P09917 1/20 0.47
MTOR P42345 1/20 0.46
AOC3 Q16853 2/20 0.44
HTR2A P28223 3/20 0.43
HRH1 P35367 3/20 0.43
ACHE P22303 1/20 0.42
CRHBP P24387 1/20 0.42
CRHR2 Q13324 1/20 0.42
ADRA2A P08913 1/20 0.40
ADRA2C P18825 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
LMNA P02545 1/20 0.40
HIF1A Q16665 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL774509 0.91 MEN1 (0.55) MEN1MAPTCYP2C9KMT2AKDM4E
SCHEMBL366705 0.91 MEN1 (0.55) MEN1MAPTCYP2C9KMT2AKDM4E
SCHEMBL735155 0.91 MEN1 (0.55) MEN1MAPTCYP2C9KMT2AKDM4E
Bromide SCHEMBL5789798 0.88 MEN1 (0.53) MEN1MAPTCYP2C9KMT2AKDM4E
Bromide SCHEMBL3879339 0.88 MEN1 (0.53) MEN1MAPTCYP2C9KMT2AKDM4E
Iodide SCHEMBL27880620 0.88 MEN1 (0.53) MEN1MAPTCYP2C9KMT2AKDM4E
Water SCHEMBL9747158 0.88 MEN1 (0.53) MEN1MAPTCYP2C9KMT2AKDM4E
SCHEMBL8405249 0.88 MEN1 (0.53) MEN1MAPTCYP2C9KMT2AKDM4E
Hydrochloric Acid SCHEMBL27284036 0.88 MEN1 (0.59) MEN1MAPTCYP2C9KMT2AKDM4E
Hydrochloric Acid SCHEMBL28211053 0.86 MEN1 (0.57) MEN1MAPTCYP2C9KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0458502-B1 Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom DOW GLOBAL TECHNOLOGIES INC (US) 2003-06-18 EP disclosed