SCHEMBL707839

SCHEMBL707839

Nc1ccc(Oc2cccc(Oc3cccc(N)c3)c2)cc1

nearest known ligand 0.87

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.87
SMN1; SMN2 Q16637 3/20 0.87
MAPT P10636 3/20 0.87
MEN1 O00255 2/20 0.87
KMT2A Q03164 2/20 0.87
MITF O75030 1/20 0.87
GAA P10253 1/20 0.87
GFER P55789 1/20 0.87
NLRP1 Q9C000 1/20 0.87
NOD2 Q9HC29 1/20 0.87
MAOB P27338 2/20 0.76
NPC1 O15118 1/20 0.68
RAB9A P51151 1/20 0.68
NLRP3 Q96P20 1/20 0.68
MAOA P21397 2/20 0.64
CYP3A4 P08684 2/20 0.61
TSHR P16473 1/20 0.61
TDP1 Q9NUW8 1/20 0.61
POLB P06746 1/20 0.55
HSP90AA1 P07900 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8836596 1.00 ALDH1A1 (0.87) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL29558001 1.00 ALDH1A1 (0.87) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL16731181 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL710424 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL8432560 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL15876510 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL29366093 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
SCHEMBL63373 0.98 ALDH1A1 (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
4-Phenoxyaniline SCHEMBL1066956 0.96 MAOB (0.84) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A
Benzene SCHEMBL9434273 0.96 MAOB (0.83) ALDH1A1SMN1; SMN2MAPTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 514 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240343879-A1 POLYMER AEROGEL WITH IMPROVED MECHANICAL AND THERMAL PROPERTIES Blueshift Materials, Inc. 2024-10-17 US claimed
US-12054598-B2 Polymer aerogel with improved mechanical and thermal properties Blueshift Materials, Inc. (US) 2024-08-06 US claimed
US-20220380568-A1 POLYMER AEROGEL WITH IMPROVED MECHANICAL AND THERMAL PROPERTIES Blueshift Materials, Inc. 2022-12-01 US claimed
US-11427693-B2 Polymer aerogel with improved mechanical and thermal properties BLUESHFT MATERIALS, INC. (US) 2022-08-30 US claimed
EP-3368198-B1 HIGHLY BRANCHED NON-CROSSLINKED AEROGEL, METHODS OF MAKING, AND USES THEREOF BLUESHIFT MAT INC (US) 2022-07-06 EP claimed
CN-108348871-B Highly branched, non-crosslinked aerogels, method for the production thereof and use thereof 蓝移材料有限公司 2021-11-05 CN claimed
US-11021606-B2 Multilayer film for electronic circuitry applications E I DU PONT DE NEMOURS AND COMPANY (US) 2021-06-01 US claimed
US-10626239-B2 Polymer aerogel with improved mechanical and thermal properties Blueshift Materials, Inc. (US) 2020-04-21 US claimed
WO-2018200838-A1 HIGHLY BRANCHED NON-CROSSLINKED AEROGEL HAVING MACROPORES, METHODS OF MAKING, AND USES THEREOF Blueshift Materials, Inc. (US) 2018-11-01 WO claimed
US-20180305514-A1 POLYMER AEROGEL WITH IMPROVED MECHANICAL AND THERMAL PROPERTIES Blueshift Materials, Inc. 2018-10-25 US claimed
EP-1672009-A1 Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device E.I.Du pont de nemours and company (US) 2006-06-21 EP claimed
US-20060124693-A1 Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device E. I. DU PONT DE NEMOURS AND COMPANY 2006-06-15 US claimed
US-20060127686-A1 Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device E. I. DU PONT DE NEMOURS AND COMPANY 2006-06-15 US claimed
US-20060068211-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2006-03-30 US claimed
EP-1531657-A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto E. I. du Pont de Nemours and Company (US) 2005-05-18 EP claimed
US-20050100719-A1 Vaiations in glass transition temperature between layers; electroconductive layer DUPONT ELECTRONICS, INC. 2005-05-12 US claimed
EP-1431984-A1 Polymer resistor composition having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto E. I. du Pont de Nemours and Company (US) 2004-06-23 EP claimed
US-20040113127-A1 Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto E.I. DU PONT DE NEMOURS AND COMPANY 2004-06-17 US claimed
EP-1424352-A1 Low temperature polymide adhesive compositions and methods relating thereto E.I.Du pont de nemours and company (US) 2004-06-02 EP claimed
US-20040099374-A1 Low temperature polyimide adhesive compositions and methods relating thereto DUPONT ELECTRONICS, INC. 2004-05-27 US claimed