Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL151976 | 0.80 | — | — | |
| SCHEMBL5387971 | 0.68 | KDM4E (0.32) | — | |
| SCHEMBL1270082 | 0.68 | — | — | |
| SCHEMBL7923109 | 0.68 | — | — | |
| SCHEMBL5718334 | 0.63 | HDAC3 (0.34) | GAA | |
| SCHEMBL10531052 | 0.62 | HDAC3 (0.33) | GAA | |
| SCHEMBL10434070 | 0.60 | MCL1 (0.49) | MAPK1 | |
| SCHEMBL7157484 | 0.57 | TSHR (0.31) | — | |
| SCHEMBL1581889 | 0.55 | — | — | |
| SCHEMBL2687621 | 0.54 | CRBN (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118359996-A | Pressure-sensitive adhesive sheet | 日东电工株式会社 | 2024-07-19 | — | — | CN | disclosed |
| CN-115135739-B | Hot melt adhesive composition and adhesive sheet | 日东电工株式会社 | 2024-07-16 | — | — | CN | disclosed |
| CN-113348409-B | Liquid crystal panel and liquid crystal display device | 日东电工株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-118318299-A | Heat conductive sheet | 日东电工株式会社 | 2024-07-09 | — | — | CN | disclosed |
| CN-118240494-A | Pressure-sensitive adhesive sheet | 日东电工株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-112789550-B | Method for manufacturing light modulation element | 日东电工株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-118159615-A | Laminate, optical member, and optical device | 日东电工株式会社 | 2024-06-07 | — | — | CN | disclosed |
| CN-118139941-A | Adhesive composition | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118119682-A | Adhesive composition, adhesive sheet, and surface protective film | 日东电工株式会社 | 2024-05-31 | — | — | CN | disclosed |
| CN-118076568-A | Resin composition for coating optical fiber, colored coating material for optical fiber, and optical fiber | 住友电气工业株式会社 | 2024-05-24 | — | — | CN | disclosed |
| CN-110637069-A | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device | 日东电工株式会社 | 2019-12-31 | — | — | CN | disclosed |
| WO-2019203236-A1 | OPTICAL FIBER | 住友電気工業株式会社 | 2019-10-24 | — | — | WO | disclosed |
| WO-2019194198-A1 | RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBER, AND OPTICAL FIBER | 住友電気工業株式会社 | 2019-10-10 | — | — | WO | disclosed |
| WO-2019151194-A1 | ADHESIVE SHEET AND PEELING METHOD FOR ADHESIVE SHEET | 日東電工株式会社 | 2019-08-08 | — | — | WO | disclosed |
| WO-2019151192-A1 | METHOD FOR PEELING ADHESIVE SHEET | 日東電工株式会社 | 2019-08-08 | — | — | WO | disclosed |
| CN-104755556-B | Electroconductive polymer/polyanionic complexes organic solvent dispersion, the conductive composition containing the organic solvent dispersion and the conductive film covering as made from the conductive composition | 荒川化学工业株式会社 | 2018-12-14 | — | — | CN | disclosed |
| US-20180267351-A1 | LIQUID CRYSTAL PANEL WITH TOUCH SENSING FUNCTION AND LIQUID CRYSTAL DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| CN-104755556-A | Organic solvent dispersoid for conductive polymer/polyanion complex, conductive composition containing said dispersoid, and conductive film obtained from said composition | ARAKAWA CHEM IND | 2015-07-01 | — | — | CN | disclosed |
| EP-1332191-A2 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2003-08-06 | — | — | EP | disclosed |
| WO-2002038691-A2 | HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET | NITTO DENKO CORPORATION (JP) | 2002-05-16 | — | — | WO | disclosed |