SCHEMBL711079

SCHEMBL711079

CC(C/N=C\c1ccccc1O)/N=C\c1ccccc1O

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.61
ALDH1A1 P00352 5/20 0.61
MAPT P10636 5/20 0.61
KMT2A Q03164 3/20 0.61
CA12 O43570 7/20 0.58
CA2 P00918 7/20 0.58
CA9 Q16790 6/20 0.54
ALOX15 P16050 3/20 0.45
GAA P10253 3/20 0.45
HPGD P15428 3/20 0.45
POLB P06746 2/20 0.45
HSD17B10 Q99714 2/20 0.45
TDP1 Q9NUW8 2/20 0.45
USP2 O75604 1/20 0.45
ALOX12 P18054 1/20 0.45
RECQL P46063 1/20 0.45
SIRT2 Q8IXJ6 1/20 0.44
THRB P10828 2/20 0.41
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9437414 1.00 KDM4E (0.61) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL145541 1.00 KDM4E (0.61) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL1270639 1.00 KDM4E (0.61) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL29365933 1.00 KDM4E (0.61) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL4582238 0.93 CA12 (0.69) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL4582240 0.93 CA12 (0.69) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL11666565 0.91 KDM4E (0.53) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL11666564 0.91 KDM4E (0.53) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL16317121 0.88 CA12 (0.63) KDM4EALDH1A1MAPTKMT2ACA12
SCHEMBL7101276 0.88 CA12 (0.63) KDM4EALDH1A1MAPTKMT2ACA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 475 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3786233-B1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-04-23 EP claimed
US-20240315945-A1 COMPOSITION FOR STIMULATING FACIAL HAIR GROWTH AND METHODS OF MANUFACTURING A COMPOSITION FOR STIMULATING FACIAL HAIR GROWTH Abe Pharmaceutical Inc. (US) 2024-09-26 US claimed
US-12005134-B2 Composition for stimulating facial hair growth and methods of manufacturing a composition for stimulating facial hair growth Abe Pharmaceutical (US) 2024-06-11 US claimed
US-11924979-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-05 US claimed
US-11866665-B2 Anti-fouling compositions for use in crude oil production and processing ECOLAB USA INC. (US) 2024-01-09 US claimed
WO-2024006560-A1 COMPOSITION FOR STIMULATING FACIAL HAIR GROWTH AND METHODS OF MANUFACTURING A COMPOSITION FOR STIMULATING FACIAL HAIR GROWTH Abe Pharmaceutical (US) 2024-01-04 WO claimed
EP-4267704-A1 ANTI-FOULING COMPOSITIONS FOR USE IN CRUDE OIL PRODUCTION AND PROCESSING Ecolab USA, Inc. (US) 2023-11-01 EP claimed
WO-2022147046-A1 ANTI-FOULING COMPOSITIONS FOR USE IN CRUDE OIL PRODUCTION AND PROCESSING ECOLAB USA INC. (US) 2022-07-07 WO claimed
US-20210147629-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-05-20 US claimed
US-20210147680-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-05-20 US claimed
WO-2009029373-A1 ANTIOXIDANT BLENDS SUITABLE FOR USE IN BIODIESELS ALBEMARLE CORPORATION (US) 2009-03-05 WO claimed
US-20090001315-A1 ALKALINE AQUEOUS SOLUTION COMPOSITION USED FOR WASHING OR ETCHING SUBSTRATES KANTO KAGAKU KABUSHIKI KAISHA (JP) 2009-01-01 US claimed
US-5944858-A CONTAINING MANGANESE CARBONYL COMPOUND AND OVERBASED COMPOUND ETHYL PETROLEUM ADDITIVES, LTD. (GB) 1999-08-31 US claimed
US-5525127-A HYDROCARBON DISTILLATE FUELS COMPRISING CYCLOPENTADIENYL MANGANESE TRICARBONYL COMPOUND, SUCCINIC DERIVATIVE, ALIPHATIC DICARBOXYLIC ACID, METAL DEACTIVATOR ETHYL PETROLEUM ADDITIVES LIMITED (GB) 1996-06-11 US claimed
EP-0662507-A2 Evaporative burner fuels and additives therefor ETHYL PETROLEUM ADDITIVES LIMITED (GB) 1995-07-12 EP claimed
EP-0476197-B1 Hydrocarbonaceous fuel compositions and additives therefor ETHYL PETROLEUM ADDITIVES LTD (GB) 1994-01-12 EP claimed
EP-0476196-B1 Hydrocarbonaceous fuel compositions and additives therefor ETHYL PETROLEUM ADDITIVES LTD (GB) 1993-11-18 EP claimed
EP-0476197-A1 Hydrocarbonaceous fuel compositions and additives therefor ETHYL PETROLEUM ADDITIVES LIMITED (GB) 1992-03-25 EP claimed
EP-0476196-A1 Hydrocarbonaceous fuel compositions and additives therefor ETHYL PETROLEUM ADDITIVES LIMITED (GB) 1992-03-25 EP claimed
US-4826898-A HEAT STABILIZERS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-05-02 US claimed