SCHEMBL711903

SCHEMBL711903

C=C(C)C(=O)OCC(O)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.46

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
THRB P10828 1/20 0.33
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL712225 0.98 TSHR (0.45) TSHRTHRBALDH1A1
SCHEMBL711741 0.98 TSHR (0.45) TSHRTHRBALDH1A1
SCHEMBL868315 0.98 TSHR (0.45) TSHRTHRBALDH1A1
SCHEMBL248147 0.95 TSHR (0.50) TSHRTHRBALDH1A1
SCHEMBL7771162 0.94 TSHR (0.49) TSHRTHRBALDH1A1
SCHEMBL7771149 0.94 TSHR (0.49) TSHRTHRBALDH1A1
SCHEMBL7767146 0.92 TSHR (0.50) TSHRTHRBALDH1A1
SCHEMBL1321683 0.92 TSHR (0.41) TSHRTHRB
SCHEMBL30497903 0.91 TSHR (0.39) TSHRTHRB
SCHEMBL1321681 0.90 TSHR (0.41) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7031589-B2 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA (US) 2006-04-18 US claimed
US-20040264908-A1 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA, INC. 2004-12-30 US claimed
CN-118852900-A Low-refractive-index optical fiber coating resin and application thereof 武汉尚赛光电科技有限公司 2024-10-29 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
US-11992367-B2 Acoustic-wave-probe resin material, acoustic lens, acoustic wave probe, acoustic wave determination device, ultrasound diagnostic apparatus, photo-acoustic wave determination device, ultrasonic endoscope, and method for producing acoustic lens FUJIFILM CORPORATION (JP) 2024-05-28 US disclosed
CN-110537146-B Photosensitive resin composition 日产化学株式会社 2024-03-15 CN disclosed
CN-110537147-B Photosensitive resin composition 日产化学株式会社 2024-03-12 CN disclosed
EP-3777696-B1 ACOUSTIC WAVE PROBE RESIN MATERIAL, ACOUSTIC LENS, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, ULTRASONIC DIAGNOSTIC APPARATUS, PHOTOACOUSTIC WAVE MEASURING APPARATUS, ULTRASONIC ENDOSCOPE, AND METHOD FOR MANUFACTURING ACOUSTIC LENS FUJIFILM CORP (JP) 2024-02-28 EP disclosed
WO-2024024501-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2024-02-01 WO disclosed
WO-2024024502-A1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2024-02-01 WO disclosed
CN-110573963-B Photosensitive resin composition 日产化学株式会社 2023-10-24 CN disclosed
EP-1723181-A1 TELECHELIC POLYMERS CONTAINING REACTIVE FUNCTIONAL GROUPS THE PENN STATE RESEARCH FOUNDATION (US) 2006-11-22 EP disclosed
US-20060189750-A1 Polyurethane-polymer hybrid-dispersion with enhanced surface properties, method for the production and utilization thereof CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2006-08-24 US disclosed
US-7031589-B2 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA (US) 2006-04-18 US disclosed
WO-2005085297-A1 TELECHELIC POLYMERS CONTAINING REACTIVE FUNCTIONAL GROUPS PENN STATE RESEARCH FOUNDATION (US) 2005-09-15 WO disclosed
US-20050182208-A1 Telechelic polymers containing reactive functional groups THE PENN STATE RESEARCH FOUNDATION 2005-08-18 US disclosed
US-20050147685-A1 Hydrogel of (semi) interpenetrating network structure and process for producing the same HOKKAIDO TECHNOLOGY LICENSING OFFICE CO., LTD. (JP) 2005-07-07 US disclosed
EP-1505093-A1 HYDROGEL OF (SEMI)INTERPENETRATING NETWORK STRUCTURE AND PROCESS FOR PRODUCING THE SAME Hokkaido Technology Licensing Office Co., Ltd. (JP) 2005-02-09 EP disclosed
US-20040264908-A1 Material for attenuating light signals with low reflectance in a fiber optic network FURUKAWA ELECTRIC NORTH AMERICA, INC. 2004-12-30 US disclosed
US-20040063049-A1 Silver salt photothermographic dry imaging material KONICA CORPORATION (JP) 2004-04-01 US disclosed