SCHEMBL7122797

SCHEMBL7122797

CC1(C)CC(O)=CC=C1c1ccc(O)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.39
ESR1 P03372 6/20 0.37
ESR2 Q92731 5/20 0.37
SENP1 Q9P0U3 1/20 0.32
MMP3 P08254 1/20 0.32
BCL2L1 Q07817 1/20 0.32
HSD17B10 Q99714 2/20 0.32
HSD17B1 P14061 1/20 0.31
MEN1 O00255 3/20 0.31
KMT2A Q03164 3/20 0.31
NPC1 O15118 2/20 0.31
MAPT P10636 2/20 0.31
NFKB1 P19838 2/20 0.31
RAB9A P51151 2/20 0.31
USP2 O75604 1/20 0.31
TP53 P04637 1/20 0.31
PKM P14618 1/20 0.31
NFKB2 Q00653 1/20 0.31
RELA Q04206 1/20 0.31
ABL1 P00519 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2767697 0.77 ESR1 (0.37) SMN1; SMN2ESR1ESR2MMP3BCL2L1
SCHEMBL8735556 0.77 ESR1 (0.37) SMN1; SMN2ESR1ESR2MMP3BCL2L1
SCHEMBL28653409 0.73 MEN1 (0.34) ESR1ESR2MMP3BCL2L1HSD17B10
SCHEMBL5077540 0.65 SMN1; SMN2 (0.46) SMN1; SMN2ESR1ESR2SENP1MMP3
SCHEMBL14193568 0.63 ESR1 (0.50) SMN1; SMN2ESR1ESR2SENP1MMP3
SCHEMBL13859776 0.60 ESR1 (0.46) SMN1; SMN2ESR1ESR2MMP3BCL2L1
SCHEMBL9090705 0.59 ESR1 (1.00) SMN1; SMN2ESR1ESR2MMP3BCL2L1
Hydroquinone SCHEMBL5712110 0.59 ESR1 (1.00) SMN1; SMN2ESR1ESR2MMP3BCL2L1
SCHEMBL6292004 0.59 ESR1 (1.00) SMN1; SMN2ESR1ESR2MMP3BCL2L1
SCHEMBL30826784 0.59 ESR1 (1.00) SMN1; SMN2ESR1ESR2MMP3BCL2L1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112513737-B Underlayer film forming composition 三菱瓦斯化学株式会社 2024-11-15 CN disclosed
US-20210294214-A1 UNDERLAYER FILM FORMING COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-23 US disclosed
EP-3832390-A1 UNDERLAYER FILM-FORMING COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-06-09 EP disclosed
CN-112513737-A Underlayer film-forming composition 三菱瓦斯化学株式会社 2021-03-16 CN disclosed
WO-2020026879-A1 UNDERLAYER FILM-FORMING COMPOSITION 三菱瓦斯化学株式会社 2020-02-06 WO disclosed
EP-1361241-A1 Process for producing raw polycarbonate resin material and producing polycarbonate resin IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-11-12 EP disclosed
US-6462165-B1 REDUCED CONTENT OF IMPURITIES SUCH AS REMAINING MONOMERS AND OLIGOMERS AND HAVING EXCELLENT PHYSICAL PROPERTIES SUCH AS IMPACT STRENGTH, AND ALSO TO OPTICAL MATERIALS AND BLOW MOLDING MATERIALS IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2002-10-08 US disclosed
US-5739186-A CURABLE MIXTURE OF A BISPHENOL F DIGLYCIDYL ETHER AND AN EPOXIDIZED NOVOLAK OR A BISPHENOL DIGLYCIDYL ETHER TYPE OF COMPOUND; LOW VISCOSITY; HEAT AND STRESS RESISTANCE; LOW MOISTURE ABSORPTION; NONCRACKING SOLDERING SHELL OIL COMPANY (US) 1998-04-14 US disclosed