SCHEMBL7130827

SCHEMBL7130827

CCCO[Si](C)(CN)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7131654 0.79
SCHEMBL12190461 0.78
SCHEMBL705229 0.77
SCHEMBL1608023 0.77
SCHEMBL134646 0.77
SCHEMBL703925 0.77
SCHEMBL1069120 0.75 DNM1 (0.35)
SCHEMBL22661023 0.74
SCHEMBL1596137 0.74
SCHEMBL203159 0.74 CA1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0330456-B1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORP (JP) 1994-09-07 EP claimed
EP-0276860-A2 Method for preparing urea-functional organosilicon compounds Toray Silicone Company, Ltd. (JP) 1988-08-03 EP claimed
US-6664021-B1 Acid generator and silicon-containing polyimide ester precursor comprising partially esterified silicon-containing polyamic ester; radiating with light CHISSO CORPORATION (JP) 2003-12-16 US disclosed
EP-0601203-B1 PHOTOSENSITIVE RESIN COMPOSITION CHISSO CORP (JP) 1999-09-29 EP disclosed
EP-0546814-B1 A polyimide photosensitive cover coating agent CHISSO CORP (JP) 1997-09-17 EP disclosed
US-5589319-A FLUORINE-CONTAINING POLYIMIDE, ISOCYANURATE HAVING A (METH)ACRYLIC GROUP, POLYALKYLENE GLYCOL DI(METH)ACRYLATE, AND PHOTOPOLYMERIZATION INITIATOR CHISSO CORPORATION (JP) 1996-12-31 US disclosed
EP-0456469-B1 Photosensitive heat-resistant polymer having hydroxyphenyl group CHISSO CORP (JP) 1996-08-21 EP disclosed
US-5473040-A A protective coatings comprising a crosslinked terpolymer of polyimide, polysilsesquioxane and polysiloxane; hardness, heat resistance, insulation CHISSO CORPORATION (JP) 1995-12-05 US disclosed
US-5449705-A Silicon-containing polyamic acid derivative and photosensitive resin composition using it CHISSO CORPORATION (JP) 1995-09-12 US disclosed
US-5449588-A Shrinkage inhibition CHISSO CORPORATION (JP) 1995-09-12 US disclosed
US-5442024-A Polyamic acid having a crosslinkable silane group or copolymerized with a polysiloxane and a compound generating an acid catalyst to effect imidation upon radiating; films; photoresists; shrinkage inhibition; resolution; adhesion CHISSO CORPORATION (JP) 1995-08-15 US disclosed
US-4963635-A REACTING A FLUORINE-CONTAINING DIANHYDRIDE OR DIANHYDRIDE, A FLUORINE-CONTAINING DIAMINE OR A DEIAMINE AND AN AMINO-CONTAINING OXYSILANE COMPOUND CHISSO CORPORATION (JP) 1990-10-16 US disclosed
EP-0379377-A2 Process for preparing photosensitive heat-resistant polymer Chisso Corporation (JP) 1990-07-25 EP disclosed
EP-0348092-A2 Photosensitive polymer having thiol groups Chisso Corporation (JP) 1989-12-27 EP disclosed
EP-0341028-A2 Process for the preparation of photosensitive polymers Chisso Corporation (JP) 1989-11-08 EP disclosed
EP-0337698-A2 Photosensitive Polymer Chisso Corporation (JP) 1989-10-18 EP disclosed
EP-0330456-A1 Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom CHISSO CORPORATION (JP) 1989-08-30 EP disclosed
EP-0276860-A2 Method for preparing urea-functional organosilicon compounds Toray Silicone Company, Ltd. (JP) 1988-08-03 EP disclosed
US-3950308-A POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES CIBA-GEIGY CORPORATION (US) 1976-04-13 US disclosed
US-3948835-A POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS CIBA-GEIGY CORPORATION (US) 1976-04-06 US disclosed