SCHEMBL7138778

SCHEMBL7138778

CCOC(=O)C(OC(C)C)(OC(C)C)C(C)=O.CCOC(=O)CC(C)=O.O=[Ti](O)O

nearest known ligand 0.38

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
MGAM O43451 2/20 0.38
GAA P10253 2/20 0.38
SI P14410 2/20 0.38
MGAM2 Q2M2H8 2/20 0.38
MMP8 P22894 1/20 0.33
PKM P14618 2/20 0.33
KDM4E B2RXH2 1/20 0.33
THRB P10828 1/20 0.32
HTT P42858 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27551330 0.83 MMP8 (0.40) MGAMGAASIMGAM2MMP8
SCHEMBL16085928 0.83 GAA (0.40) MGAMGAASIMGAM2MMP8
SCHEMBL9738748 0.82 MMP8 (0.39) MGAMGAASIMGAM2MMP8
SCHEMBL3698190 0.82 MMP8 (0.39) MGAMGAASIMGAM2MMP8
SCHEMBL4541515 0.82 MMP8 (0.39) MGAMGAASIMGAM2MMP8
Acetoacetic Acid SCHEMBL28846724 0.81 MMP8 (0.36) MMP8PKMKDM4ETHRBHTT
SCHEMBL8179113 0.78 GAA (0.61) MGAMGAASIMGAM2KDM4E
SCHEMBL1109723 0.78 GAA (0.61) MGAMGAASIMGAM2KDM4E
SCHEMBL1368493 0.78 MMP8 (0.42) MGAMGAASIMGAM2MMP8
SCHEMBL1360787 0.73 GAA (0.54) MGAMGAASIMGAM2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5449573-A Subbing layer of organometallic compound, silane coupler, binder resin FUJI XEROX CO., LTD. (JP) 1995-09-12 US claimed
US-20240101856-A1 COATING COMPOSITION AND COATED ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-28 US disclosed
EP-4299686-A1 COATING COMPOSITION AND COATED ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-01-03 EP disclosed
US-10454411-B2 Light-condensing film, solar cell module, and transfer mold DAIKIN INDUSTRIES, LTD. (JP) 2019-10-22 US disclosed
US-9176474-B2 Light-concentrating film, method for producing same, focusing element, solar cell, and focusing method DAIKIN INDUSTRIES, LTD. (JP) 2015-11-03 US disclosed
US-20140216549-A1 LIGHT-CONDENSING FILM, SOLAR CELL MODULE, AND TRANSFER MOLD DAIKIN INDUSTRIES, LTD. (JP) 2014-08-07 US disclosed
EP-2762930-A1 LIGHT-CONDENSING FILM, SOLAR CELL MODULE, AND TRANSFER MOLD Daikin Industries, Ltd. (JP) 2014-08-06 EP disclosed
EP-2687877-A1 LIGHT-GATHERING FILM AND SOLAR BATTERY MODULE Daikin Industries, Ltd. (JP) 2014-01-22 EP disclosed
US-20140000710-A1 LIGHT-GATHERING FILM AND SOLAR BATTERY MODULE DAIKIN INDUSTRIES, LTD. (JP) 2014-01-02 US disclosed
EP-2477051-A1 LIGHT-CONCENTRATING FILM, METHOD FOR PRODUCING SAME, FOCUSING ELEMENT, SOLAR CELL, AND FOCUSING METHOD Daikin Industries, Ltd. (JP) 2012-07-18 EP disclosed
US-20120156434-A1 LIGHT-CONCENTRATING FILM, METHOD FOR PRODUCING SAME, FOCUSING ELEMENT, SOLAR CELL, AND FOCUSING METHOD DAIKIN INDUSTRIES, LTD. (JP) 2012-06-21 US disclosed
US-6509432-B2 Oxidative curable silicon modified vinyl-based resin obtained by combining an epoxy group-containing vinyl copolymer with an unsaturated fatty acid and a silicone resin with a hydroxyl and/or an alkoxyl group bonded to silicon KANSAI PAINT CO., LTD. (JP) 2003-01-21 US disclosed
US-20020010269-A1 Ordinary temperature curable coating composition KANSAI PAINT CO., LTD. (JP) 2002-01-24 US disclosed
US-6132664-A SEALS OF ALKOXY ROOM TEMPERATURE VULCANIZATION SILOXANES WITH GROOVES, EXPOSURE AND CURING DOW CORNING CORPORATION (US) 2000-10-17 US disclosed
EP-1008613-A2 Process for preparing room temperature vulcanizing silicone compositions DOW CORNING CORPORATION (US) 2000-06-14 EP disclosed
US-5929140-A AN ALIPHATIC HYDROCARBON SOLVENT, AN ACRYLIC POLYMER CONTAINING LACTONE REPEATING UNIT, A POLYMER FINE PARTICLES INSOLUBLE IN ABOVE ORGANIC SOLVENT AND A CROSSLINKING AGENT; WATER RESISTANCE, WEATHERPROOFING AND CHEMICAL RESISTNCE NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1999-07-27 US disclosed
EP-0926205-A1 Method of forming a seal in a confined configuration using an alkoxy-functional rtv composition DOW CORNING CORPORATION (US) 1999-06-30 EP disclosed
EP-0714962-A1 COATING RESIN COMPOSITION NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1996-06-05 EP disclosed
US-5449573-A Subbing layer of organometallic compound, silane coupler, binder resin FUJI XEROX CO., LTD. (JP) 1995-09-12 US disclosed