⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5885503 | 0.82 | — | — | |
| SCHEMBL4865213 | 0.82 | — | — | |
| SCHEMBL7973038 | 0.82 | — | — | |
| SCHEMBL16037 | 0.82 | — | — | |
| SCHEMBL18886767 | 0.82 | — | — | |
| SCHEMBL8849452 | 0.82 | — | — | |
| SCHEMBL10578755 | 0.82 | — | — | |
| SCHEMBL2241382 | 0.67 | — | — | |
| Water SCHEMBL1263931 | 0.67 | — | — | |
| SCHEMBL259182 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7755075-B2 | Phase-change memory device with minimized reduction in thermal efficiency and method of manufacturing the same | ELPIDA MEMORY, INC. (JP) | 2010-07-13 | — | — | US | claimed |
| US-7532507-B2 | Phase change memory device and method for manufacturing phase change memory device | ELPIDA MEMORY, INC. (JP) | 2009-05-12 | — | — | US | claimed |
| US-7498601-B2 | Phase-change memory device and method of manufacturing same | ELPIDA MEMORY, INC. (JP) | 2009-03-03 | — | — | US | claimed |
| US-7368802-B2 | Phase-change memory device and method of manufacturing same | ELPIDA MEMORY, INC. (JP) | 2008-05-06 | — | — | US | claimed |
| US-20080042118-A1 | PHASE-CHANGE MEMORY DEVICE WITH MINIMIZED REDUCTION IN THERMAL EFFICIENCY AND METHOD OF MANUFACTURING THE SAME | ELPIDA MEMORY, INC. (JP) | 2008-02-21 | — | — | US | claimed |
| US-20070267669-A1 | Phase-changeable memory device and method of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-11-22 | — | — | US | claimed |
| US-20070165452-A1 | PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING PHASE CHANGE MEMORY DEVICE | ELPIDA MEMORY, INC. (JP) | 2007-07-19 | — | — | US | claimed |
| US-20070120107-A1 | PHASE-CHANGE MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | ELPIDA MEMORY, INC | 2007-05-31 | — | — | US | claimed |
| US-20070120106-A1 | PHASE-CHANGE MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | ELPIDA MEMORY, INC | 2007-05-31 | — | — | US | claimed |
| EP-2628826-A1 | Coated cutting tool and method for making the same | Sandvik Intellectual Property AB (SE) | 2013-08-21 | — | — | EP | disclosed |
| US-8513051-B2 | Methods of forming phase-changeable memory devices including an adiabatic layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-08-20 | — | — | US | disclosed |
| US-20120049107-A1 | SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING PROCESS AND METHOD OF FORMING PHASE CHANGE MEMORY DEVICE USING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-03-01 | — | — | US | disclosed |
| US-7910398-B2 | Phase-change memory device and method of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-03-22 | — | — | US | disclosed |
| US-7838326-B2 | Methods of fabricating semiconductor device including phase change layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-11-23 | — | — | US | disclosed |
| US-20070120107-A1 | PHASE-CHANGE MEMORY DEVICE AND METHOD OF MANUFACTURING SAME | ELPIDA MEMORY, INC | 2007-05-31 | — | — | US | disclosed |
| US-20060039192-A1 | Phase-changeable memory devices including an adiabatic layer and methods of forming the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-02-23 | — | — | US | disclosed |
| US-20060030108-A1 | Semiconductor device and method of fabricating the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-02-09 | — | — | US | disclosed |
| US-20050174861-A1 | Phase-change memory device and method of manufacturing the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-08-11 | — | — | US | disclosed |
| WO-2003033758-A1 | DECORATIVE HARD COATING AND METHOD FOR MANUFACTURE | THE CHINESE UNIVERSITY OF HONG KONG (CN) | 2003-04-24 | — | — | WO | disclosed |
| US-20030072974-A1 | Decorative hard coating and method for manufacture | CHINESE UNIVERSITY OF HONG KONG, THE (HK) | 2003-04-17 | — | — | US | disclosed |