SCHEMBL7176153

SCHEMBL7176153

CCCCCCCC[C](CC)CC

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 3/20 0.52
CES1 P23141 3/20 0.52
GPR84 Q9NQS5 7/20 0.50
PPARG P37231 7/20 0.50
PPARD Q03181 7/20 0.50
PPARA Q07869 7/20 0.50
TSHR P16473 5/20 0.50
HDAC11 Q96DB2 5/20 0.50
PTPN1 P18031 3/20 0.50
ALDH1A1 P00352 2/20 0.50
TLR2 O60603 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
FABP4 P15090 2/20 0.50
SLC22A6 Q4U2R8 1/20 0.50
SLC22A8 Q8TCC7 1/20 0.50
MEN1 O00255 1/20 0.50
ESR1 P03372 1/20 0.50
ALOX15 P16050 1/20 0.50
PDE4A P27815 1/20 0.50
KMT2A Q03164 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9210104 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL10583668 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL9211285 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL4442011 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL6270153 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL3336428 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL7185269 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL7178071 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL7181819 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD
SCHEMBL4539814 1.00 CES2 (0.52) CES2CES1GPR84PPARGPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118302485-A Resin composition 日产化学株式会社 2024-07-05 CN disclosed
CN-117099046-A Photosensitive resin composition for forming insulating film 日产化学株式会社 2023-11-21 CN disclosed
WO-2023176259-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INSULATING FILM 日産化学株式会社 2023-09-21 WO disclosed
WO-2023106108-A1 PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2023-06-15 WO disclosed
WO-2023106101-A1 RESIN COMPOSITION 日産化学株式会社 2023-06-15 WO disclosed
US-11643544-B2 Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-05-09 US disclosed
CN-108349919-B Polyfunctional epoxy compound and curable composition containing the same 日产化学工业株式会社 2022-06-03 CN disclosed
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN disclosed
CN-109843965-B Epoxy resin composition for forming printed wiring board 日产化学株式会社 2021-07-27 CN disclosed
CN-108350252-B Epoxy reactive diluent and epoxy resin composition containing same 日产化学工业株式会社 2021-04-09 CN disclosed
WO-2012175399-A1 WASHING OR CLEANING AGENT HAVING INCREASED CLEANING PERFORMANCE HENKEL AG & CO. KGAA (DE) 2012-12-27 WO disclosed
EP-0938842-B1 Sustained release pheromone dispenser SHINETSU CHEMICAL CO (JP) 2003-10-15 EP disclosed
US-6355236-B2 Sustained release pheromone formation SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-03-12 US disclosed
US-20010053372-A1 SUSTAINED RELEASE PHEROMONE FORMATION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-20 US disclosed
EP-0938842-A1 Sustained release pheromone dispenser SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-09-01 EP disclosed
US-4892680-A OXIDATION RESISTANCE NIPPON OIL CO., LTD. (JP) 1990-01-09 US disclosed
EP-0305114-A1 Heat treating oil NIPPON OIL CO. LTD. (JP) 1989-03-01 EP disclosed
US-4737297-A MONO-SUBSTITUTED NAPHTHALENES NIPPON OIL CO., LTD. (JP) 1988-04-12 US disclosed
US-4665275-A OXIDATION-RESISTANT NAPHTHALENE DERIVATIVE NIPPON OIL CO., LTD. (JP) 1987-05-12 US disclosed
US-3934975-A Leather treating process DIAMOND SHAMROCK CORPORATION (US) 1976-01-27 US disclosed