Known targets — ChEMBL curated mechanism
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
The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 4/20 | 0.50 |
| ▸ | BLM | P54132 | 4/20 | 0.50 |
| ▸ | CA5A | P35218 | 2/20 | 0.50 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.50 |
| ▸ | ATM | Q13315 | 1/20 | 0.50 |
| ▸ | ATR | Q13535 | 1/20 | 0.50 |
| ▸ | CA1 | P00915 | 1/20 | 0.43 |
| ▸ | CA2 | P00918 | 1/20 | 0.43 |
| ▸ | NT5E | P21589 | 1/20 | 0.43 |
| ▸ | CA4 | P22748 | 1/20 | 0.43 |
| ▸ | CA6 | P23280 | 1/20 | 0.43 |
| ▸ | CA7 | P43166 | 1/20 | 0.43 |
| ▸ | CA9 | Q16790 | 1/20 | 0.43 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.40 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.40 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Sulfuric Acid SCHEMBL4208198 | 0.96 | — | — | |
| Sulfuric Acid SCHEMBL28001969 | 0.92 | BLM (0.60) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL4348364 | 0.88 | BLM (0.56) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL10455785 | 0.88 | BLM (0.47) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL10539875 | 0.85 | KDM4E (0.50) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL10609373 | 0.85 | BLM (0.44) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL10455782 | 0.85 | BLM (0.44) | TSHRBLMCA5ACA5BKDM4E | |
| Sulfuric Acid SCHEMBL11431920 | 0.83 | BLM (0.50) | TSHRBLMCA5ACA5BKDM4E | |
| Thiosulfuric Acid SCHEMBL10494243 | 0.83 | — | — | |
| Sulfamate SCHEMBL22345885 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6602440-B2 | Etching with composition comprising acid, oxidizing agent, complexing agent, and metal complex which precipitates when applied; for production of printed circuit boards | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-08-05 | — | — | US | claimed |
| CN-110148719-B | Preparation method and application of modified thin-wall hierarchical porous carbon for lithium-sulfur battery | 浙江大学 | 2021-01-12 | — | — | CN | disclosed |
| US-6602440-B2 | Etching with composition comprising acid, oxidizing agent, complexing agent, and metal complex which precipitates when applied; for production of printed circuit boards | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-08-05 | — | — | US | disclosed |
| US-6579591-B2 | Etching with an acid, oxidizing agent, a copper complexing agent, and a copper complex which precipitates when applied to the copper substrate; forms microporosity for adhesion; printed circuits | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-06-17 | — | — | US | disclosed |
| EP-0926265-B1 | Method and compositions for producing copper surfaces for improved bonding and articles made therefrom | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-11-13 | — | — | EP | disclosed |
| US-20020056702-A1 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | ATOTECH USA, LLC | 2002-05-16 | — | — | US | disclosed |
| US-20020048685-A1 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | ATOTECH USA, LLC | 2002-04-25 | — | — | US | disclosed |
| US-6284309-B1 | APPLYING ETCHANT COMPRISING ACID, OXIDIZER AND COMPLEXING AGENT AND COPPER COMPLES TO COPPER OR ITS ALLOY SUBSTRATE TO PREPARE SURFACE CAPABLE OF MAKING CONTINUOUS BOND | ATOTECH DEUTSCHLAND GMBH (DE) | 2001-09-04 | — | — | US | disclosed |
| US-6086779-A | A CLEANING SURFACE TREATMENT IN THE PRODUCTION OF PRINTED CIRCUITS BY FORMING A COMPLEXES | MCGEAN-ROHCO, INC. (US) | 2000-07-11 | — | — | US | disclosed |
| US-6063172-A | ELECTROLESS DEPOSITION OF TIN, LEAD, BISMUTH, INDIUM, GALLIUM AND GERMANIUM MAY BE DEPOSITED ONTO A METAL SURFACE UTILIZING A COMPLEXING AGENT SELECTED FROM THE GROUP CONSISTING OF THIOUREA COMPOUNDS AND IMIDAZOLE THIONES, AND AN AMIDINE | MCGEAN-ROHCO, INC. (US) | 2000-05-16 | — | — | US | disclosed |
| EP-0926265-A1 | Method and compositions for producing copper surfaces for improved bonding and articles made therefrom | McGean-Rohco, Inc. (US) | 1999-06-30 | — | — | EP | disclosed |