SCHEMBL7183891

SCHEMBL7183891

O=COC[C@H](O)[C@H](O)CO

nearest known ligand 0.45

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
AKR1B1 P15121 1/20 0.36
LMNA P02545 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
TDP1 Q9NUW8 1/20 0.33
MPI P34949 1/20 0.30
PDE4A P27815 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2161822 1.00 AKR1B1 (0.36) AKR1B1LMNAL3MBTL1TDP1MPI
SCHEMBL21419878 0.86 LMNA (0.50) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL13564709 0.86 LMNA (0.50) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL13564642 0.86 LMNA (0.50) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL13564638 0.86 LMNA (0.43) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL10537769 0.86 LMNA (0.50) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL2299087 0.84 LMNA (0.48) AKR1B1LMNAL3MBTL1TDP1PDE4A
SCHEMBL13127977 0.77
SCHEMBL8950619 0.77
SCHEMBL180216 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6576695-B1 Thermal aging resistance AJINOMOTO CO., INC. (JP) 2003-06-10 US disclosed
EP-0908491-B1 Thermoplastic resin composition, agent for improving thermal aging resistance of thermoplastic resin, and resin molded article obtained therefrom AJINOMOTO KK (JP) 2003-02-26 EP disclosed
EP-1086985-A2 Thermoplastic resin composition, agent for improving thermal aging resistance of thermoplastic resin, and resin molded article obtained therefrom Ajinomoto Co., Inc. (JP) 2001-03-28 EP disclosed
US-6147148-A WHERE THE ESTER HAS A DEGREE OF ESTERIFICATION OF NOT MORE THAN 50% AJINOMOTO CO., INC. (JP) 2000-11-14 US disclosed
EP-0908491-A2 Thermoplastic resin composition, agent for improving thermal aging resistance of thermoplastic resin, and resin molded article obtained therefrom Ajinomoto Co., Inc. (JP) 1999-04-14 EP disclosed