SCHEMBL7189642

SCHEMBL7189642

C=C(C)C(=O)OC(CC)C1CO1

nearest known ligand 0.46

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.46
TSHR P16473 3/20 0.35
THRB P10828 1/20 0.33
PRKCA P17252 3/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8469871 0.88 ALDH1A1 (0.47) ALDH1A1TSHRTHRB
SCHEMBL21196520 0.87 ALDH1A1 (0.44) ALDH1A1TSHRTHRB
SCHEMBL31405775 0.85 ALDH1A1 (0.45) ALDH1A1TSHR
SCHEMBL21196516 0.84 ALDH1A1 (0.41) ALDH1A1TSHRTHRBPRKCA
SCHEMBL26970624 0.83 ALDH1A1 (0.44) ALDH1A1TSHR
SCHEMBL195062 0.82 ALDH1A1 (0.42) ALDH1A1TSHR
SCHEMBL7647413 0.81 ALDH1A1 (0.41) ALDH1A1TSHRTHRB
SCHEMBL971734 0.81 ALDH1A1 (0.41) ALDH1A1TSHRTHRB
SCHEMBL6933723 0.81 ALDH1A1 (0.49) ALDH1A1TSHR
SCHEMBL26970633 0.80 ALDH1A1 (0.41) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112241107-B Positive photosensitive resin composition, photosensitive resin film and display device using the same 株式会社东进世美肯 2025-03-11 CN claimed
CN-112241107-A Positive photosensitive resin composition, photosensitive resin film, and display device using same 株式会社东进世美肯 2021-01-19 CN claimed
CN-104937491-B Photosensitive resin composition and method for forming pattern using the same 东进世美肯株式会社 2020-01-14 CN claimed
CN-105143978-B Photosensitive resin composition, pattern forming method and liquid crystal display device using the same 东进世美肯株式会社 2019-12-13 CN claimed
CN-114690559-A Photosensitive resin composition, cured film and display device 株式会社东进世美肯 2022-07-01 CN disclosed
CN-109328390-B Conductive shaped body with positive temperature coefficient 纺织和塑料研究协会图林根研究院 2021-11-05 CN disclosed
CN-112241107-A Positive photosensitive resin composition, photosensitive resin film, and display device using same 株式会社东进世美肯 2021-01-19 CN disclosed
CN-104937491-B Photosensitive resin composition and method for forming pattern using the same 东进世美肯株式会社 2020-01-14 CN disclosed
CN-104808439-B Photoresist composition and method for manufacturing thin film transistor substrate 三星显示有限公司 2019-12-31 CN disclosed
CN-105143978-B Photosensitive resin composition, pattern forming method and liquid crystal display device using the same 东进世美肯株式会社 2019-12-13 CN disclosed
US-10468164-B2 Electrically conductive shaped body with a positive temperature coefficient THUERINGISCHES INSTITUT FUER TEXTIL-UND KUNSTSTOFF-FORSCHUNG E.V. (DE) 2019-11-05 US disclosed
US-20190237224-A1 ELECTRICALLY CONDUCTIVE SHAPED BODY WITH A POSITIVE TEMPERATURE COEFFICIENT THUERINGISCHES INSTITUT FUER TEXTIL- UND KUNSTSTOFF-FORSCHUNG E.V. (DE) 2019-08-01 US disclosed
CN-1878665-B Material composites made of a moulded part made of transparent or translucent, dyeable plastic thermoplastic moulding compositions EMS CHEMIE AG 2010-05-05 CN disclosed
CN-1878665-A Material composites made of a moulded part made of transparent or translucent, dyeable plastic thermoplastic moulding compositions EMS CHEMIE AG (CH) 2006-12-13 CN disclosed
EP-0798331-B1 PROCESS FOR THE PRODUCTION OF THERMOPLASTIC RESIN COMPOSITION KURARAY CO (JP) 2003-01-15 EP disclosed
US-5773517-A POLYESTER, ADDITION POLYMER KURARAY CO., LTD. (JP) 1998-06-30 US disclosed
EP-0798331-A1 PROCESS FOR THE PRODUCTION OF THERMOPLASTIC RESIN COMPOSITION KURARAY CO., LTD. (JP) 1997-10-01 EP disclosed