SCHEMBL7192189

SCHEMBL7192189

C=CCc1c(CC)ccc2ccccc12

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCEH1 Q6PIU2 2/20 0.40
ATM Q13315 1/20 0.39
HSD17B10 Q99714 3/20 0.38
CYP1A2 P05177 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
MTNR1A P48039 1/20 0.38
KDM4E B2RXH2 5/20 0.37
ALDH1A1 P00352 3/20 0.37
TDP1 Q9NUW8 2/20 0.37
CYP2A6 P11509 1/20 0.37
TSHR P16473 1/20 0.37
GAA P10253 2/20 0.37
MAPT P10636 2/20 0.37
GLA P06280 1/20 0.37
HPGD P15428 1/20 0.37
IMPDH2 P12268 1/20 0.36
TAAR1 Q96RJ0 1/20 0.36
KMT2A Q03164 2/20 0.35
MEN1 O00255 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL253635 0.87 HSD17B10 (0.41) HSD17B10CYP1A2CYP2C9CYP2C19KDM4E
SCHEMBL9403708 0.87 ATM (0.40) NCEH1ATMHSD17B10CYP1A2CYP2C9
SCHEMBL7192193 0.86 NCEH1 (0.40) NCEH1ATMHSD17B10CYP1A2CYP2C9
SCHEMBL8637918 0.86 HSD17B10 (0.40) HSD17B10CYP1A2CYP2C9CYP2C19KDM4E
SCHEMBL20025903 0.84 NCEH1 (0.42) NCEH1ATMHSD17B10CYP1A2CYP2C9
SCHEMBL3845755 0.83 THRA (0.41) NCEH1HSD17B10CYP1A2CYP2C19KDM4E
SCHEMBL103056 0.81 NCEH1 (0.50) NCEH1ATMHSD17B10CYP1A2CYP2C9
SCHEMBL11497864 0.81 TDP1 (0.54) HSD17B10CYP1A2CYP2C9CYP2C19KDM4E
SCHEMBL11860817 0.80 NCEH1 (0.43) NCEH1ATMHSD17B10CYP1A2CYP2C9
SCHEMBL9403710 0.80 NCEH1 (0.43) NCEH1ATMHSD17B10CYP1A2CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115677980-A Epoxy resin, preparation method thereof and resin composition 华为技术有限公司 2023-02-03 CN disclosed
US-6534595-B2 Blend of thermosetting resin, decomposable resin and solvent SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-03-18 US disclosed
US-20010038887-A1 Coating solution for forming porous organic film SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-11-08 US disclosed