SCHEMBL7194381

SCHEMBL7194381

CC1COC(=O)C2(CC(=O)O1)CC2C

nearest known ligand 0.48

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.40
CA1 P00915 1/20 0.36
CA9 Q16790 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6402462 0.82 CA1 (0.39) SMN1; SMN2CA1CA9
SCHEMBL8052756 0.79 CA1 (0.37) SMN1; SMN2CA1CA9
SCHEMBL8596087 0.73 SMN1; SMN2 (0.33) SMN1; SMN2CA1CA9
SCHEMBL7095071 0.73 SMN1; SMN2 (0.33) SMN1; SMN2CA1CA9
SCHEMBL2755811 0.70 SMN1; SMN2 (0.48) SMN1; SMN2CA1CA9
SCHEMBL8051918 0.69 CA1 (0.37) SMN1; SMN2CA1CA9
SCHEMBL7571311 0.67 SMN1; SMN2 (0.50) SMN1; SMN2CA1CA9
SCHEMBL17506144 0.67 CA1 (0.56) SMN1; SMN2CA1CA9
SCHEMBL17506143 0.67 CA1 (0.56) SMN1; SMN2CA1CA9
SCHEMBL30599022 0.67 CA1 (0.56) SMN1; SMN2CA1CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0807644-B1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-02-12 EP claimed
US-5969009-A COATING IRON CORE WITH A MOLDING MATERIAL CONTAINING A THERMOSETTING RESIN BINDER WITH AN UNSATURATED POLYESTER, AN ADDITION-POLYMERIZABLE MONOMER HAVING AN AFFINITY FOR ALKALINE SOLUTION, ALSO A LOW SHRINKAGE AGENT MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) 1999-10-19 US claimed
EP-0807644-A1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-11-19 EP claimed
JP-10095904-A None JP disclosed
EP-0807644-B1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-02-12 EP disclosed
US-5969009-A COATING IRON CORE WITH A MOLDING MATERIAL CONTAINING A THERMOSETTING RESIN BINDER WITH AN UNSATURATED POLYESTER, AN ADDITION-POLYMERIZABLE MONOMER HAVING AN AFFINITY FOR ALKALINE SOLUTION, ALSO A LOW SHRINKAGE AGENT MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) 1999-10-19 US disclosed
JP-H1095904-A MOLD MATERIAL AND MOLD MOTOR MATSUSHITA ELECTRIC IND CO LTD 1998-04-14 JP disclosed
EP-0807644-A1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-11-19 EP disclosed