SCHEMBL7199226

SCHEMBL7199226

CCC(COC)OC.CCOCCOCC

nearest known ligand 0.40

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.40
TSHR P16473 1/20 0.33
PRKD3 O94806 1/20 0.32
PRKCG P05129 1/20 0.32
PRKCB P05771 1/20 0.32
PRKCA P17252 1/20 0.32
PRKCH P24723 1/20 0.32
PRKCI P41743 1/20 0.32
PRKCE Q02156 1/20 0.32
PRKCQ Q04759 1/20 0.32
PRKCZ Q05513 1/20 0.32
PRKCD Q05655 1/20 0.32
PRKD1 Q15139 1/20 0.32
LPAR6 P43657 3/20 0.31
LPAR1 Q92633 3/20 0.31
LPAR4 Q99677 3/20 0.31
LPAR5 Q9H1C0 3/20 0.31
LPAR2 Q9HBW0 3/20 0.31
LPAR3 Q9UBY5 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL210480 0.87
SCHEMBL14904900 0.87
SCHEMBL14904958 0.87
SCHEMBL8332801 0.82 PRKD3 (0.31) PRKD3PRKCGPRKCBPRKCAPRKCH
SCHEMBL8539607 0.82
Ether SCHEMBL15671753 0.82 ALDH1A1 (0.39) ALDH1A1PRKD3PRKCGPRKCBPRKCA
SCHEMBL30891797 0.82 PRKD3 (0.42) ALDH1A1PRKD3PRKCGPRKCBPRKCA
SCHEMBL16580154 0.82
SCHEMBL27466717 0.81 PRKD3 (0.39) ALDH1A1PRKD3PRKCGPRKCBPRKCA
SCHEMBL14904902 0.80 PRKD3 (0.41) ALDH1A1PRKD3PRKCGPRKCBPRKCA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230203249-A1 POLYIMIDE-BASED COMPOSITION AND POLYIMIDE FILM DONGJIN SEMICHEM CO., LTD. (KR) 2023-06-29 US claimed
US-20230203249-A1 POLYIMIDE-BASED COMPOSITION AND POLYIMIDE FILM DONGJIN SEMICHEM CO., LTD. (KR) 2023-06-29 US disclosed
US-10030133-B2 Black photosensitive resin composition and use of same KANEKA CORPORATION (JP) 2018-07-24 US disclosed
US-20150044451-A1 BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME KANEKA CORPORATION 2015-02-12 US disclosed
US-8828525-B2 Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate KANEKA CORPORATION (JP) 2014-09-09 US disclosed
US-20130183499-A1 FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE KANEKA CORPORATION (JP) 2013-07-18 US disclosed
EP-1331258-A1 Pressure sensitive adhesive compositions KRATON Polymers Research B.V. (NL) 2003-07-30 EP disclosed
EP-1191954-A1 HOT MELT PRESSURE SENSITIVE POSITIONING ADHESIVE (III) KRATON Polymers Research B.V. (NL) 2002-04-03 EP disclosed
WO-2001000257-A1 HOT MELT PRESSURE SENSITIVE POSITIONING ADHESIVE (III) KRATON POLYMERS RESEARCH B.V. (NL) 2001-01-04 WO disclosed