SCHEMBL7202174

SCHEMBL7202174

c1ccc(C2SC(c3ccccn3)SC(c3ccccn3)S2)nc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.50
LMNA P02545 3/20 0.50
CCR1 P32246 2/20 0.50
CCR5 P51681 2/20 0.50
CCR8 P51685 2/20 0.50
CYP1A2 P05177 1/20 0.50
POLB P06746 1/20 0.50
METAP1 P53582 1/20 0.50
BLM P54132 1/20 0.50
HIF1A Q16665 1/20 0.50
DOHH Q9BU89 1/20 0.50
P4HTM Q9NXG6 1/20 0.50
NPC1 O15118 5/20 0.48
RAB9A P51151 5/20 0.48
MAPT P10636 4/20 0.48
ALDH1A1 P00352 4/20 0.48
KMT2A Q03164 2/20 0.48
GLA P06280 1/20 0.46
ATM Q13315 2/20 0.43
CTH P32929 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5308858 0.80 KDM4E (0.46) KDM4ELMNACCR1CCR5CCR8
SCHEMBL9270417 0.78 KDM4E (0.44) KDM4ELMNACCR1CCR5CCR8
SCHEMBL10971119 0.75 GFER (0.41) KDM4ELMNACCR1CCR5CCR8
SCHEMBL28876311 0.74 KDM4E (0.50) KDM4ELMNACCR1CCR5CCR8
SCHEMBL13197255 0.72 KDM4E (0.48) KDM4ELMNACCR1CCR5CCR8
SCHEMBL659325 0.72 KDM4E (0.48) KDM4ELMNACCR1CCR5CCR8
SCHEMBL12533662 0.72 OPRM1 (0.49) KDM4ELMNACCR1CCR5CCR8
SCHEMBL900225 0.72
SCHEMBL20740275 0.72
SCHEMBL3392695 0.72 OPRM1 (0.49) KDM4ELMNACCR1CCR5CCR8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed