SCHEMBL7202635

SCHEMBL7202635

c1nn[nH]c1SSc1cnn[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9868986 0.82 — —
SCHEMBL16907284 0.78 — —
SCHEMBL4146105 0.78 — —
SCHEMBL11426676 0.72 — —
SCHEMBL12221453 0.72 — —
SCHEMBL6051450 0.72 — —
SCHEMBL6051456 0.72 — —
SCHEMBL4311579 0.71 CYP2C9 (0.33) —
SCHEMBL14220785 0.69 — —
SCHEMBL4318926 0.68 MAPK1 (0.30) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10758569-B2 Heteroaryl disulfide compounds as allosteric effectors for increasing the oxygen-binding affinity of hemoglobin THE GENERAL HOSPITAL CORPORATION (US) 2020-09-01 — — US claimed
EP-3626707-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN The General Hospital Corporation (US) 2020-03-25 — — EP claimed
EP-3094619-B1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN MASSACHUSETTS GEN HOSPITAL (US) 2019-07-31 — — EP claimed
EP-3094619-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN The General Hospital Corporation (US) 2016-11-23 — — EP claimed
US-20160331782-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN THE GENERAL HOSPITAL CORPORATION 2016-11-17 — — US claimed
WO-2015106240-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN THE GENERAL HOSPITAL CORPORATION (US) 2015-07-16 — — WO claimed
US-11939691-B2 Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath ISHIHARA CHEMICAL CO., LTD. (JP) 2024-03-26 — — US disclosed
US-20240018180-A1 OLIGONUCLEOTIDE PRODUCTION METHOD AJINOMOTO CO., INC. (JP) 2024-01-18 — — US disclosed
US-10758569-B2 Heteroaryl disulfide compounds as allosteric effectors for increasing the oxygen-binding affinity of hemoglobin THE GENERAL HOSPITAL CORPORATION (US) 2020-09-01 — — US disclosed
US-10758569-B2 Heteroaryl disulfide compounds as allosteric effectors for increasing the oxygen-binding affinity of hemoglobin THE GENERAL HOSPITAL CORPORATION (US) 2020-09-01 — — US disclosed
EP-3626707-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN The General Hospital Corporation (US) 2020-03-25 — — EP disclosed
EP-3626707-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN The General Hospital Corporation (US) 2020-03-25 — — EP disclosed
EP-3094619-B1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN MASSACHUSETTS GEN HOSPITAL (US) 2019-07-31 — — EP disclosed
EP-3094619-B1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN MASSACHUSETTS GEN HOSPITAL (US) 2019-07-31 — — EP disclosed
US-20160331782-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN THE GENERAL HOSPITAL CORPORATION 2016-11-17 — — US disclosed
US-20160331782-A1 HETEROARYL DISULFIDE COMPOUNDS AS ALLOSTERIC EFFECTORS FOR INCREASING THE OXYGEN-BINDING AFFINITY OF HEMOGLOBIN THE GENERAL HOSPITAL CORPORATION 2016-11-17 — — US disclosed
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 — — US disclosed
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