SCHEMBL7203640

SCHEMBL7203640

CSc1ccc(SSc2ccccn2)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EHMT2 Q96KQ7 1/20 0.65
EHMT1 Q9H9B1 1/20 0.65
APOBEC3G Q9HC16 1/20 0.65
KMT2A Q03164 5/20 0.47
MAPT P10636 4/20 0.47
NPC1 O15118 5/20 0.46
RAB9A P51151 5/20 0.46
TP53 P04637 2/20 0.46
TSHR P16473 2/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
SMN1; SMN2 Q16637 4/20 0.39
LMNA P02545 2/20 0.39
ALDH1A1 P00352 4/20 0.36
HPGD P15428 4/20 0.36
HSD17B10 Q99714 2/20 0.36
MGLL Q99685 1/20 0.36
GRM4 Q14833 1/20 0.36
HTR2C P28335 1/20 0.35
HTR2B P41595 1/20 0.35
MEN1 O00255 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11825400 0.90 EHMT2 (0.81) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL184886 0.85 EHMT2 (0.65) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL11824315 0.84 EHMT2 (0.71) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL15044501 0.84 EHMT2 (0.77) EHMT2EHMT1APOBEC3GKMT2AMAPT
Methyl Alcohol SCHEMBL28484914 0.81 EHMT2 (0.90) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL21174 0.81 EHMT2 (1.00) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL29349787 0.81 EHMT2 (1.00) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL27972393 0.81 EHMT2 (1.00) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL28757007 0.81 EHMT2 (0.65) EHMT2EHMT1APOBEC3GKMT2AMAPT
SCHEMBL21799186 0.81 EHMT2 (0.65) EHMT2EHMT1APOBEC3GKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6607653-B1 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with DAIWA FINE CHEMICALS CO., LTD. (JP) 2003-08-19 US disclosed