SCHEMBL720694

SCHEMBL720694

C=C[Si](O)(O)CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15302506 0.83
SCHEMBL6533060 0.81 TSHR (0.39)
SCHEMBL2288387 0.77 TSHR (0.32)
SCHEMBL3482218 0.77
SCHEMBL203443 0.75
SCHEMBL2287206 0.74
SCHEMBL2290926 0.72
SCHEMBL3481517 0.72
SCHEMBL3481505 0.71 TSHR (0.37)
SCHEMBL4525324 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20060201544-A1 Filler sheet for solar cell module, and solar cell module using the same DAI NIPPON PRINTING CO., LTD. (JP) 2006-09-14 US claimed
US-12015094-B2 Sealing material sheet for solar-cell module and solar-cell module using the same DAI NIPPON PRINTING CO., LTD. (JP) 2024-06-18 US disclosed
EP-4354522-A1 RESIN FILM FOR CURRENT COLLECTING SHEET, CURRENT COLLECTING SHEET, SOLAR CELL ELEMENT WITH CURRENT COLLECTING SHEET, AND SOLAR CELL DAI NIPPON PRINTING CO., LTD. (JP) 2024-04-17 EP disclosed
WO-2023238844-A1 RESIN FILM FOR CURRENT COLLECTOR SHEETS, FILM FOR CURRENT COLLECTOR SHEETS, CURRENT COLLECTOR SHEET, SOLAR CELL ELEMENT WITH CURRENT COLLECTOR SHEET, AND SOLAR CELL 大日本印刷株式会社 2023-12-14 WO disclosed
US-20230303892-A1 HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET LINTEC CORPORATION (JP) 2023-09-28 US disclosed
EP-3901966-B1 CONDUCTIVE ADHESIVE SHEET, LAMINATE, AND HEATING DEVICE LINTEC CORP (JP) 2023-09-13 EP disclosed
US-20230250316-A1 ADHESIVE AGENT FOR HIGH-FREQUENCY INDUCTION HEATING LINTEC CORPORATION (JP) 2023-08-10 US disclosed
EP-4174146-A1 HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET LINTEC CORPORATION (JP) 2023-05-03 EP disclosed
WO-2023054730-A1 SOLAR CELL MODULE INSULATION FILM, INSULATION FILM WITH STEEL SHEET, INSULATION FILM WITH WIRING SHEET, AND SOLAR CELL MODULE 大日本印刷株式会社 2023-04-06 WO disclosed
US-20230099082-A1 SEALING MATERIAL SHEET FOR SOLAR-CELL MODULE AND SOLAR-CELL MODULE USING THE SAME DAI NIPPON PRINTING CO., LTD. (JP) 2023-03-30 US disclosed
CN-100546052-C Solar module is with encapsulant layer and use its solar module DAINIPPON PRINTING CO LTD (JP) 2009-09-30 CN disclosed
US-20090173384-A1 ENCAPSULANT FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE USING SAME AND PRODUCTION METHOD OF PHOTOVOLTAIC MODULE SANYO ELECTRIC CO., LTD. (JP) 2009-07-09 US disclosed
US-7521515-B2 Filler layer for solar cell module and solar cell module using same DAI NIPPON PRINTING CO., LTD. (JP) 2009-04-21 US disclosed
US-20080302417-A1 FILLER SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE USING THE SAME INOUE ISAO 2008-12-11 US disclosed
EP-1956660-A1 BACK-PROTECTIVE SHEET FOR SOLAR CELL MODULE, BACK LAMINATE FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE Dainippon Printing Co., Ltd. (JP) 2008-08-13 EP disclosed
EP-1956661-A1 FILLER FOR SOLAR CELL MODULE, SOLAR CELL MODULE USING SAME, AND METHOD FOR PRODUCING FILLER FOR SOLAR CELL MODULE Dainippon Printing Co., Ltd. (JP) 2008-08-13 EP disclosed
US-20060219294-A1 Oxide semiconductor electrode, dye-sensitized solar cell, and, method of producing the same DAI NIPPON PRINTING CO., LTD. 2006-10-05 US disclosed
US-20060201544-A1 Filler sheet for solar cell module, and solar cell module using the same DAI NIPPON PRINTING CO., LTD. (JP) 2006-09-14 US disclosed
CN-1799147-A Filler layer for solar cell module and solar cell module using same DAINIPPON PRINTING CO LTD (JP) 2006-07-05 CN disclosed
US-20060142490-A1 Filler layer for solar cell module and solar cell module using same DAI NIPPON PRINTING CO., LTD. (JP) 2006-06-29 US disclosed