⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14694560 | 0.87 | — | — | |
| SCHEMBL9270463 | 0.87 | — | — | |
| SCHEMBL27517051 | 0.82 | — | — | |
| SCHEMBL5145518 | 0.82 | — | — | |
| SCHEMBL8829641 | 0.82 | — | — | |
| SCHEMBL8731245 | 0.82 | — | — | |
| SCHEMBL446903 | 0.82 | — | — | |
| SCHEMBL11414109 | 0.78 | — | — | |
| SCHEMBL23673292 | 0.67 | — | — | |
| SCHEMBL387227 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-222574550-U | Vacuum glass with edge sealing structure | 福耀高性能玻璃科技(福建)有限公司 | 2025-03-07 | — | — | CN | claimed |
| CN-118910436-A | Separating equipment based on vacuum distillation and method for vacuum separation and purification of indium tin lead-free solder | 昆明理工大学 | 2024-11-08 | — | — | CN | claimed |
| CN-116086226-B | Water-gas heat exchange system and method for pumping compressed air energy storage | 中国电建集团华东勘测设计研究院有限公司 | 2023-10-20 | — | — | CN | claimed |
| CN-116086226-A | Water-gas heat exchange system and method for pumping compressed air energy storage | 中国电建集团华东勘测设计研究院有限公司 | 2023-05-09 | — | — | CN | claimed |
| CN-107390914-A | Contact panel and display device | 深圳欧菲光科技股份有限公司 | 2017-11-24 | — | — | CN | claimed |
| US-9166130-B2 | Solderless mounting for semiconductor lasers | SPECTRASENSORS, INC. (US) | 2015-10-20 | — | — | US | claimed |
| EP-2912733-A1 | SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS | SpectraSensors, Inc. (US) | 2015-09-02 | — | — | EP | claimed |
| CN-104756330-A | Solderless mounting for semiconductor lasers | SPECTRASENSORS INC | 2015-07-01 | — | — | CN | claimed |
| WO-2014066526-A1 | SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS | SPECTRASENSORS, INC. (US) | 2014-05-01 | — | — | WO | claimed |
| US-20140112363-A1 | SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS | SPECTRASENSORS, INC. | 2014-04-24 | — | — | US | claimed |
| JP-7234420-A | — | — | None | — | — | JP | disclosed |
| CN-222574550-U | Vacuum glass with edge sealing structure | 福耀高性能玻璃科技(福建)有限公司 | 2025-03-07 | — | — | CN | disclosed |
| CN-118910436-A | Separating equipment based on vacuum distillation and method for vacuum separation and purification of indium tin lead-free solder | 昆明理工大学 | 2024-11-08 | — | — | CN | disclosed |
| CN-118910436-A | Separating equipment based on vacuum distillation and method for vacuum separation and purification of indium tin lead-free solder | 昆明理工大学 | 2024-11-08 | — | — | CN | disclosed |
| CN-118910436-A | Separating equipment based on vacuum distillation and method for vacuum separation and purification of indium tin lead-free solder | 昆明理工大学 | 2024-11-08 | — | — | CN | disclosed |
| CN-104756330-A | Solderless mounting for semiconductor lasers | SPECTRASENSORS INC | 2015-07-01 | — | — | CN | disclosed |
| WO-2014066526-A1 | SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS | SPECTRASENSORS, INC. (US) | 2014-05-01 | — | — | WO | disclosed |
| US-20140112363-A1 | SOLDERLESS MOUNTING FOR SEMICONDUCTOR LASERS | SPECTRASENSORS, INC. | 2014-04-24 | — | — | US | disclosed |
| US-6627987-B1 | Ceramic semiconductor package and method for fabricating the package | AMKOR TECHNOLOGY, INC. | 2003-09-30 | — | — | US | disclosed |
| JP-H07234420-A | ACTIVE MATRIX LIQUID CRYSTAL DISPLAY DEVICE | NEC CORP | 1995-09-05 | — | — | JP | disclosed |