Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNA7 | P36544 | 2/20 | 0.74 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.68 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.67 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.67 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.65 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.65 |
| ▸ | HRH4 | Q9H3N8 | 2/20 | 0.64 |
| ▸ | HRH3 | Q9Y5N1 | 2/20 | 0.64 |
| ▸ | HRH1 | P35367 | 2/20 | 0.63 |
| ▸ | CHRNB2 | P17787 | 2/20 | 0.58 |
| ▸ | CHRNA4 | P43681 | 2/20 | 0.58 |
| ▸ | TBXAS1 | P24557 | 3/20 | 0.57 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.56 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29485692 | 1.00 | CHRNA7 (0.74) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL10452373 | 0.93 | CHRNA7 (0.65) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL8700016 | 0.93 | CYP1A2 (0.66) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL7705277 | 0.91 | CHRNA7 (0.63) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL724788 | 0.90 | TDP1 (0.80) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL29485677 | 0.90 | CYP2A6 (0.76) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL29485675 | 0.90 | TDP1 (0.80) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL2843094 | 0.90 | CYP2A6 (0.76) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL8658187 | 0.87 | HRH1 (0.81) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 | |
| SCHEMBL29485667 | 0.87 | HRH1 (0.81) | CHRNA7CYP2A6CYP1A2CYP2D6TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11697884-B2 | Copper deposition in wafer level packaging of integrated circuits | MACDERMID ENTHONE INC. (US) | 2023-07-11 | — | — | US | disclosed |
| US-20210388519-A1 | Copper Deposition in Wafer Level Packaging of Integrated Circuits | MACDERMID ENTHONE INC. | 2021-12-16 | — | — | US | disclosed |
| US-11124888-B2 | Copper deposition in wafer level packaging of integrated circuits | MACDERMID ENTHONE INC. (US) | 2021-09-21 | — | — | US | disclosed |
| EP-3504186-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MacDermid Enthone Inc. (US) | 2019-07-03 | — | — | EP | disclosed |
| US-10221496-B2 | Copper filling of through silicon vias | MACDERMID ENTHONE INC. (US) | 2019-03-05 | — | — | US | disclosed |
| US-20190003068-A9 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2019-01-03 | — | — | US | disclosed |
| WO-2018226988-A1 | PROCESS FOR FILLING VIAS IN THE MANUFACTURE OF MICROELECTRONICS | MACDERMID ENTHONE INC. (US) | 2018-12-13 | — | — | WO | disclosed |
| US-20180355502-A1 | PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MICROELECTRONICS | CITIBANK, N.A. | 2018-12-13 | — | — | US | disclosed |
| US-10103029-B2 | Process for filling vias in the microelectronics | MACDERMID ENTHONE INC. (US) | 2018-10-16 | — | — | US | disclosed |
| WO-2018057590-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MACDERMID ENTHONE INC. (US) | 2018-03-29 | — | — | WO | disclosed |
| US-20140322912-A1 | METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE INC. (US) | 2014-10-30 | — | — | US | disclosed |
| US-8771495-B2 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | ENTHONE INC. (US) | 2014-07-08 | — | — | US | disclosed |
| US-20140120722-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | ENTHONE INC. (US) | 2014-05-01 | — | — | US | disclosed |
| EP-2668317-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | Enthone, Inc. (US) | 2013-12-04 | — | — | EP | disclosed |
| US-20130241060-A1 | METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE INC. (US) | 2013-09-19 | — | — | US | disclosed |
| US-20130199935-A1 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2013-08-08 | — | — | US | disclosed |
| US-8388824-B2 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | ENTHONE INC. (US) | 2013-03-05 | — | — | US | disclosed |
| WO-2012103357-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | ENTHONE INC. (US) | 2012-08-02 | — | — | WO | disclosed |
| WO-2011149965-A2 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2011-12-01 | — | — | WO | disclosed |
| US-20100126872-A1 | ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE, INC. (US) | 2010-05-27 | — | — | US | disclosed |