SCHEMBL726192

SCHEMBL726192

C=CCOC(=O)CC(C)=NO

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.44
TDP1 Q9NUW8 1/20 0.41
MAPT P10636 1/20 0.37
CACNA1B Q00975 1/20 0.37
APBA1 Q02410 1/20 0.37
ALDH1A1 P00352 7/20 0.36
GAA P10253 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.35
CYP3A4 P08684 1/20 0.35
NPSR1 Q6W5P4 2/20 0.35
PKM P14618 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.33
MGAM O43451 1/20 0.32
SI P14410 1/20 0.32
MGAM2 Q2M2H8 1/20 0.32
LMNA P02545 1/20 0.32
EPHX2 P34913 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
NPC1 O15118 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11667698 0.81 TSHR (0.42) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL11667701 0.81 TSHR (0.42) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL9513 0.79 TSHR (0.50) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL57069 0.79 TSHR (0.52) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL1616122 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL2221470 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1
Acetone SCHEMBL28861611 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL5702374 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL5134550 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1
SCHEMBL4195402 0.78 TSHR (0.48) TSHRTDP1MAPTCACNA1BAPBA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024128086-A1 CURABLE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE 富士フイルム株式会社 2024-06-20 WO disclosed
US-9389505-B2 Polymerizable composition for solder resist, and solder resist pattern formation method FUJIFILM CORPORATION (JP) 2016-07-12 US disclosed
CN-102741751-B Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed wiring board FUJIFILM CORP 2014-07-16 CN disclosed
US-8557948-B2 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming a permanent pattern, and printed board FUJIFILM CORPORATION (JP) 2013-10-15 US disclosed
US-20130034812-A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD FUJIFILM CORPORATION (JP) 2013-02-07 US disclosed
EP-2530523-A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD FUJIFILM Corporation (JP) 2012-12-05 EP disclosed
US-20120282549-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, PHOTOSENSITIVE LAMINATE, METHOD FOR FORMING PERMANENT PATTERN, AND PRINTED BOARD FUJIFILM CORPORATION (JP) 2012-11-08 US disclosed
CN-102741751-A Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed wiring board FUJIFILM CORP 2012-10-17 CN disclosed
EP-2498130-A2 Curable composition for solid-state imaging device, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition Fujifilm Corporation (JP) 2012-09-12 EP disclosed
US-20120183776-A1 CURABLE COMPOSITION, CURABLE FILM, CURABLE LAMINATE, METHOD FOR FORMING A PERMANENT PATTERN, AND PRINTED SUBSTRATE FUJIFILM CORPORATION (JP) 2012-07-19 US disclosed
CN-101149562-A Photosensitive composition, photosensitive film, permanent pattern forming method and printing circuit board FUJIFILM CORP (JP) 2008-03-26 CN disclosed
CN-101116035-A Photosensitive composition, method for forming pattern, and permanent pattern FUJI PHOTO FILM CO LTD (JP) 2008-01-30 CN disclosed
CN-101107565-A Pattern forming material, pattern forming apparatus and permanent pattern forming method FUJI PHOTO FILM CO LTD (JP) 2008-01-16 CN disclosed
CN-101084470-A Material for pattern formation, apparatus for pattern formation, and method for pattern formation FUJI PHOTO FILM CO LTD (JP) 2007-12-05 CN disclosed
EP-1780599-A1 PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, PHOTOSENSITIVE LAMINATE, PATTERN FORMING APPARATUS AND METHOD OF PATTERN FORMATION FUJIFILM Corporation (JP) 2007-05-02 EP disclosed
WO-2005093793-A1 PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed
EP-0600262-B1 Aqueous processable, multilayer photoimageable permanent coatings for printed circuits DU PONT (US) 1999-04-21 EP disclosed
US-5405731-A Hydrophobic binder and addition polymer in protective layer with photoimageable coating containing carboxylic and unsaturated comonomers, photoinitiator and thermal crosslinking agent, for resistance to molten solder E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-04-11 US disclosed
EP-0600262-A2 Aqueous processable, multilayer photoimageable permanent coatings for printed circuits E.I. DU PONT DE NEMOURS AND COMPANY (US) 1994-06-08 EP disclosed
US-5288589-A Storage stability E.I. DU PONT DE NEMOURS AND COMPANY 1994-02-22 US disclosed