⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16594287 | 0.80 | — | — | |
| SCHEMBL17532711 | 0.75 | — | — | |
| SCHEMBL14247961 | 0.73 | — | — | |
| SCHEMBL11027763 | 0.73 | — | — | |
| SCHEMBL14518574 | 0.73 | — | — | |
| SCHEMBL5831314 | 0.71 | — | — | |
| SCHEMBL5831456 | 0.71 | — | — | |
| SCHEMBL6569721 | 0.71 | — | — | |
| SCHEMBL19043866 | 0.69 | — | — | |
| SCHEMBL17194079 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | claimed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | claimed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | claimed |
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | disclosed |
| US-8137764-B2 | organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-20 | — | — | US | disclosed |
| EP-2261390-A2 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2010-12-15 | — | — | EP | disclosed |
| US-7235490-B2 | Method of manufacturing semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-06-26 | — | — | US | disclosed |
| US-7198886-B2 | Method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2007-04-03 | — | — | US | disclosed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | disclosed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | disclosed |