⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5831314 | 0.93 | — | — | |
| SCHEMBL19043866 | 0.86 | — | — | |
| SCHEMBL6753254 | 0.86 | — | — | |
| SCHEMBL9615350 | 0.85 | — | — | |
| SCHEMBL9163240 | 0.79 | — | — | |
| SCHEMBL14446054 | 0.71 | — | — | |
| SCHEMBL728869 | 0.71 | — | — | |
| SCHEMBL11027763 | 0.69 | — | — | |
| SCHEMBL14247961 | 0.69 | — | — | |
| SCHEMBL5711909 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240213017-A1 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2024-06-27 | — | — | US | disclosed |
| EP-4299577-A1 | SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | Samsung Electronics Co., Ltd. (KR) | 2024-01-03 | — | — | EP | disclosed |
| US-20230406822-A1 | SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | DNF CO., LTD. (KR) | 2023-12-21 | — | — | US | disclosed |
| CN-108102654-B | Etchant composition and method for manufacturing integrated circuit device using the same | 三星电子株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20180142151-A1 | ETCHANT COMPOSITION AND METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE USING THE SAME | SOULBRAIN CO., LTD. (KR) | 2018-05-24 | — | — | US | disclosed |
| US-8105952-B2 | Method of forming a pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2012-01-31 | — | — | US | disclosed |
| US-7931819-B2 | Method for pattern formation | KABUSHIKI KAISHA TOSHIBA (JP) | 2011-04-26 | — | — | US | disclosed |
| US-20090078673-A1 | Method of forming a pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20080041818-A1 | Method for pattern formation | KABUSHIKI KAISHA TOSHIBA (JP) | 2008-02-21 | — | — | US | disclosed |
| US-7081503-B2 | Process producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | KANEKA CORPORATION (JP) | 2006-07-25 | — | — | US | disclosed |
| US-7009004-B2 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2006-03-07 | — | — | US | disclosed |
| US-20060004171-A1 | Process for producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | TSUJI RYOTARO | 2006-01-05 | — | — | US | disclosed |
| US-20040097678-A1 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2004-05-20 | — | — | US | disclosed |
| EP-1375531-A1 | PROCESS FOR PRODUCING VINYL POLYMER HAVING ALKENYL GROUP AT END, VINYL POLYMER, AND CURABLE COMPOSITION | KANEKA CORPORATION (JP) | 2004-01-02 | — | — | EP | disclosed |