⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3630385 | 0.87 | — | — | |
| SCHEMBL1291221 | 0.87 | — | — | |
| SCHEMBL1512688 | 0.84 | — | — | |
| Cyclopentane SCHEMBL6048924 | 0.84 | — | — | |
| SCHEMBL6048765 | 0.74 | — | — | |
| SCHEMBL14992291 | 0.72 | — | — | |
| SCHEMBL6048664 | 0.72 | — | — | |
| SCHEMBL19927410 | 0.67 | — | — | |
| SCHEMBL1637157 | 0.65 | — | — | |
| SCHEMBL4438669 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090096106-A1 | ANTIREFLECTIVE COATINGS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-04-16 | — | — | US | claimed |
| EP-2048700-A2 | Antireflective coatings | Air Products and Chemicals, Inc. (US) | 2009-04-15 | — | — | EP | claimed |
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | disclosed |
| US-20130260575-A1 | SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-10-03 | — | — | US | disclosed |
| EP-1666632-B1 | Porous low dielectric constant compositions and methods for making and using same | AIR PROD & CHEM (US) | 2013-04-24 | — | — | EP | disclosed |
| US-8293001-B2 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-10-23 | — | — | US | disclosed |
| US-8137764-B2 | organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-20 | — | — | US | disclosed |
| US-20110143032-A1 | Porogens, Porogenated Precursors and Methods for Using the Same to Provide Porous Organosilica Glass Films With Low Dielectric Constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2011-06-16 | — | — | US | disclosed |
| US-7943195-B2 | Mixing of glass with hydrocarbons; chemical vapor deposition; mixing organosilane and/or organosiloxane precursors with porogens; neohexyl-1,3,5,7-tetramethylcyclo-tetrasiloxane | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2011-05-17 | — | — | US | disclosed |
| EP-2281920-A1 | Porous low dielectric constant compositions and methods for making and using same | Air Products and Chemicals, Inc. (US) | 2011-02-09 | — | — | EP | disclosed |
| EP-2261390-A2 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2010-12-15 | — | — | EP | disclosed |
| US-7332445-B2 | Porous low dielectric constant compositions and methods for making and using same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-02-19 | — | — | US | disclosed |
| EP-1666632-A2 | Porous low dielectric constant compositions and methods for making and using same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2006-06-07 | — | — | EP | disclosed |
| US-20060078676-A1 | Porous low dielectric constant compositions and methods for making and using same | VERSUM MATERIALS US, LLC | 2006-04-13 | — | — | US | disclosed |
| US-6846515-B2 | Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2005-01-25 | — | — | US | disclosed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | disclosed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | disclosed |
| US-20030232137-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-12-18 | — | — | US | disclosed |
| US-20030198742-A1 | Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants | VERSUM MATERIALS US, LLC | 2003-10-23 | — | — | US | disclosed |
| EP-1354980-A1 | Method for forming a porous SiOCH layer. | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2003-10-22 | — | — | EP | disclosed |