SCHEMBL741180

SCHEMBL741180

Cc1cc(SSc2cc(C)nc(N)n2)nc(N)n1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSP90AB1 P08238 2/20 0.50
TSHR P16473 4/20 0.49
HSP90AA1 P07900 1/20 0.47
LMNA P02545 3/20 0.46
NPC1 O15118 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
MAPT P10636 1/20 0.46
GAA P10253 2/20 0.45
NPSR1 Q6W5P4 1/20 0.45
POLB P06746 2/20 0.42
APOBEC3G Q9HC16 1/20 0.42
SMN1; SMN2 Q16637 2/20 0.41
CRHBP P24387 1/20 0.41
CRHR2 Q13324 1/20 0.41
CYP1A2 P05177 1/20 0.40
CYP2D6 P10635 1/20 0.40
HRH3 Q9Y5N1 1/20 0.40
NUDT1 P36639 1/20 0.40
NOS3 P29474 1/20 0.39
NOS1 P29475 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28486478 0.86 HSP90AB1 (0.50) HSP90AB1TSHRHSP90AA1LMNANPC1
SCHEMBL6829600 0.84 HSP90AB1 (0.49) HSP90AB1TSHRHSP90AA1LMNANPC1
SCHEMBL151114 0.79
SCHEMBL13744682 0.79 TSHR (0.59) HSP90AB1TSHRHSP90AA1LMNANPC1
SCHEMBL7568049 0.77 HSP90AB1 (0.55) HSP90AB1TSHRHSP90AA1LMNANPC1
SCHEMBL7568606 0.77 HSP90AB1 (0.55) HSP90AB1TSHRHSP90AA1LMNANPC1
SCHEMBL30863954 0.76 HSP90AA1 (0.56) HSP90AB1TSHRHSP90AA1NPC1MAPT
SCHEMBL27651209 0.76 HSP90AA1 (0.56) HSP90AB1TSHRHSP90AA1NPC1MAPT
Ammonia Solution, Strong SCHEMBL20919221 0.76 HSP90AA1 (0.56) HSP90AB1TSHRHSP90AA1NPC1MAPT
SCHEMBL879566 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116120710-A Disulfide bond-containing high dielectric constant composite material and preparation method and application thereof 西安交通大学 2023-05-16 CN claimed
CN-116120710-A Disulfide bond-containing high dielectric constant composite material and preparation method and application thereof 西安交通大学 2023-05-16 CN disclosed
CN-116006899-A Hydrogen storage cylinder with fiber wound plastic liner 沈阳欧施盾新材料科技有限公司 2023-04-25 CN disclosed
CN-106661734-B Method for manufacturing circuit board and circuit board manufactured by the same 上村工业株式会社 2022-02-25 CN disclosed
EP-3196339-B1 METHOD FOR MANUFACTURING WIRING SUBSTRATE UEMURA KOGYO KK (JP) 2019-08-28 EP disclosed
US-20170253975-A1 METHOD FOR MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED THEREBY C. UYEMURA & CO., LTD (JP) 2017-09-07 US disclosed
EP-3196339-A1 METHOD FOR MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED THEREBY C. Uyemura & Co., Ltd. (JP) 2017-07-26 EP disclosed
US-8545946-B2 Liquid crystal alignment solution DAXIN MATERIALS CORPORATION (TW) 2013-10-01 US disclosed
US-8545946-B2 Liquid crystal alignment solution DAXIN MATERIALS CORPORATION (TW) 2013-10-01 US disclosed
US-8449101-B2 Ink composition and method of producing a processed product of printed matter FUJIFILM CORPORATION (JP) 2013-05-28 US disclosed
US-20110074896-A1 INK COMPOSITION AND METHOD OF PRODUCING A PROCESSED PRODUCT OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
US-20110074896-A1 INK COMPOSITION AND METHOD OF PRODUCING A PROCESSED PRODUCT OF PRINTED MATTER FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2302010-A1 Ink composition and method of producing a processed product of printed matter FUJIFILM Corporation (JP) 2011-03-30 EP disclosed
US-7914863-B2 Liquid crystal alignment solution DAXIN MATERIAL CORPORATION (TW) 2011-03-29 US disclosed
US-7914863-B2 Liquid crystal alignment solution DAXIN MATERIAL CORPORATION (TW) 2011-03-29 US disclosed
US-20100243955-A1 LIQUID CRYSTAL ALIGNMENT SOLUTION DAXIN MATERIALS CORPORATION (TW) 2010-09-30 US disclosed
US-20100243955-A1 LIQUID CRYSTAL ALIGNMENT SOLUTION DAXIN MATERIALS CORPORATION (TW) 2010-09-30 US disclosed
US-20100003399-A1 ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD C. UYEMURA & CO., LTD. (JP) 2010-01-07 US disclosed
US-20090194737-A1 LIQUID CRYSTAL ALIGNMENT SOLUTION DAXIN MATERIAL CORPORATION (TW) 2009-08-06 US disclosed
US-20090194737-A1 LIQUID CRYSTAL ALIGNMENT SOLUTION DAXIN MATERIAL CORPORATION (TW) 2009-08-06 US disclosed